CUC-USB3.1-J1ST-S/UCF-SMD
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USB PCB connectors
1332646
USB PCB connectors, degree of protection: IP20, number of positions: 24, 10 Gbps, material: Metal, connection method: Solder connection
Product details
| Product type | Data connector (device side) |
| Type | USB-C |
| Number of positions | 24 |
| Connection profile | USB-C |
| Type of packaging | Tape and Reel |
| [W] tape width | 24.00 mm |
| [A] coil diameter | 330.00 mm |
| Number of slots | 1 |
| Type | Socket |
| Shielded | yes |
| Insulation characteristics | |
| Overvoltage category | I |
| Degree of pollution | 2 |
| Rated voltage (III/2) | 20 V |
| Rated surge voltage (III/2) | 1500 V |
| Rated current | 5 A |
| Contact resistance | 40 mΩ |
| Frequency range | 10 Hz ... 55 Hz |
| Insulation resistance | 100 MΩ |
| Transmission medium | Copper |
| Transmission characteristics (category) | USB 3.2 Gen 2 |
| Transmission speed | 10 Gbps |
| Power transmission | 100 W |
| Connection technology | |
| Connection method | Solder connection |
| Width | 11 mm |
| Height | 3.16 mm |
| Length | 6.6 mm |
| Orientation to PCB | 180.00 ° |
| Color of the housing part | black |
| Material Metal surface contact area (top layer) | Gold-plated |
| Material Metal surface contact area (middle layer) | Nickel coating 50 µ min |
| Material Metal surface soldering area (top layer) | Tin coating 100 µ min |
| Material Metal surface soldering area (middle layer) | Nickel coating 50 µ min |
| Material | LCP |
| Flammability rating according to UL 94 | V0 |
| Housing material | Metal |
| Contact material | Copper alloy |
| Contact surface material | Gold over nickel |
| Contact carrier material | LCP |
| Test voltage Core/Core | 100 V |
| Test voltage Core/Shield | 100.00 V |
| Acceleration | 3.1 m/s² |
| Halogen-free | yes |
| Mechanical data | |
| Insertion/withdrawal cycles | > 10000 |
| Insertion force per signal contact | 20.00 N |
| Extraction force per signal contact | < 8 N |
| Test specification | |
| Specification | EIA 364-1000 |
| Frequency | 10-55 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 1.52 mm |
| Test duration | 2.00 h |
| Contact resistance R1 | 40.00 mΩ |
| Test specification | |
| Specification | 60068-2-27 |
| Acceleration | 50.00 g |
| Number of shocks per direction | 18.00 |
| Ambient conditions | |
| Degree of protection | IP20 |
| Ambient temperature (operation) | -55 °C ... 85 °C |
| Mounting type | SMD soldering |
| Processing notes | |
| Process | SMD |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
| Solder cycles in the reflow | 3 |
| Item number | 1332646 |
| Packing unit | 500 pc |
| Minimum order quantity | 500 pc |
| Sales key | ABNDAC |
| Product key | ABNDAC |
| GTIN | 4063151629953 |
| Weight per piece (including packing) | 1,19 g |
| Weight per piece (excluding packing) | 1 g |
| Customs tariff number | 85366930 |
| Country of origin | CN |
ECLASS
| ECLASS-13.0 | 27460201 |
ETIM
| ETIM 9.0 | EC002637 |
UNSPSC
| UNSPSC 21.0 | 39121400 |
| EU RoHS | |
| Fulfills EU RoHS substance requirements | Yes (No exemptions) |
| China RoHS | |
| Environment friendly use period (EFUP) |
EFUP-E
No hazardous substances above the limits
|
| EU REACH SVHC | |
| REACH candidate substance (CAS No.) | No substance above 0.1 wt% |
Your advantages
Optimized for SMD reflow soldering processes
Data transmission up to 10 Gbps
Can be processed automatically thanks to tape-on-reel packaging
PHOENIX CONTACT nv/sa
Minervastraat 10-12, 1930 Zaventem