ICE50-R100X45-A1
-
Heatsink
1328712
Heatsink for housing series: ICS, material: Aluminum, anodized, product range: ICS50-..100X.., width: 44.9 mm, height: 50.1 mm, Individual milling possible.
This product needs further products for operation.
Mandatory accessories
Product details
| General | Individual milling possible. |
| General | Please observe the application note in the download area. |
| Product type | Heatsink |
| Housing type | Heatsink |
| Housing series | ICS |
| Product family | ICS50-..100X.. |
| Dimensional drawing |
|
| Width | 44.9 mm |
| Height | 50.1 mm |
| Length | 105 mm |
| Base panel thickness [b] | 5.8 mm |
| Color | aluminum color |
| Color (Housing) | aluminum color |
| Material | Aluminum |
| Surface characteristics | anodized |
| Thermal resistance Rth | 2.4 K/W (At ΔT 65 K for ambient temperature) |
| 3.5 K/W (At ΔT 5 K for ambient temperature) |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 150 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.15 mm (10 Hz ... 58.1 Hz) |
| Acceleration | 2g (58.1 Hz ... 150 Hz) |
| Test duration per axis | 2.5 h |
| Test directions | X-, Y- and Z-axis |
| Shocks | |
| Specification | IEC 60068-2-27:2008-02 |
| Pulse shape | Semi-sinusoidal |
| Acceleration | 15g |
| Shock duration | 11 ms |
| Number of shocks per direction | 3 |
| Test directions | X-, Y- and Z-axis (pos. and neg.) |
| Test for substances that would hinder coating with paint or varnish | |
| Specification | VDMA 24364:2018-05 |
| Result | Test passed |
| Ambient conditions | |
| Ambient temperature (storage/transport) | -40 °C ... 55 °C |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Mounting type | Slot |
| Type of packaging | Box packaging |
Your advantages
Heatsinks enable the finished devices to be used in thermally demanding applications
Reliable heat dissipation with passive heatsinks
Variable positioning of the heatsink base for electronic components of different heights
Large installation space in the housing with space-saving heatsink fillers
Tailored system solution comprised of a housing, connection technology, heatsink, and additional accessories
Frequently asked questions
What support does Phoenix Contact provide in the area of thermal management?
Phoenix Contact supports you with catalog values, online simulations, personal consultation including simulation services, and (individually adapted) heatsinks.... View more
Phoenix Contact supports you with catalog values, online simulations, personal consultation including simulation services, and (individually adapted) heatsinks.
View lessFor which housing families are heatsinks available?
How is heat transferred between the hotspot and the heatsink?
The component that heats strongly (the hotspot) is connected to the heatsink by a thermally conductive material (TIM). In the case of the UCS housing system, optionally inserted heat spreaders can also bridge larger distances between the component to... View more
The component that heats strongly (the hotspot) is connected to the heatsink by a thermally conductive material (TIM). In the case of the UCS housing system, optionally inserted heat spreaders can also bridge larger distances between the component to be cooled and the heatsink.
View lessHow are components of different heights and sizes ideally connected to the heatsink?
The optimum thermal connection is implemented by individual adjustments of the heatsink. This is usually done by a milling operation on the heatsink.... View more
The optimum thermal connection is implemented by individual adjustments of the heatsink. This is usually done by a milling operation on the heatsink.
View lessWhat influence does heating have on the reliability of a device?
The maximum temperature has the greatest impact on the reliability and service life of your device. With a temperature increase of 10°C the failure rate is doubled.... View more
The maximum temperature has the greatest impact on the reliability and service life of your device. With a temperature increase of 10°C the failure rate is doubled.
View lessWhich factors influence the temperature in the housing?
Small and powerful components, high data rates, dust, and insufficient ventilation of the housing are reasons for a high temperature difference compared to the environment.... View more
Small and powerful components, high data rates, dust, and insufficient ventilation of the housing are reasons for a high temperature difference compared to the environment.
View lessWhat information do the power dissipation diagrams provide?
The graphs of the diagrams provide information on which power the components may supply in the respective housing in order not to exceed a temperature difference to the environment. The slope of the straight line describes the thermal conductance of ... View more
The graphs of the diagrams provide information on which power the components may supply in the respective housing in order not to exceed a temperature difference to the environment. The slope of the straight line describes the thermal conductance of the system. The cases shown differ, on the one hand, in that one features full-surface heating while the other features heating of a hotspot of 20 x 20 mm and, on the other hand, in that one has a printed circuit board installed in the housing and one does not have a housing.
View lessHow do heatsinks help dissipate developing heat?
The integrated heatsinks from Phoenix Contact dissipate heat from the hotspot by means of heat conduction via thermally conductive material (TIM). The heatsink releases this heat in the form of radiant energy and via convection between the slats to t... View more
The integrated heatsinks from Phoenix Contact dissipate heat from the hotspot by means of heat conduction via thermally conductive material (TIM). The heatsink releases this heat in the form of radiant energy and via convection between the slats to the environment. The stack effect is utilized, during which the heated air rises and is displaced by cold air.
View lessWhat other options are there for thermal optimization?
In many cases, rearranging the hotspots or installing vents is sufficient. A simulation of the thermal conditions provides information on which option is best suited.... View more
In many cases, rearranging the hotspots or installing vents is sufficient. A simulation of the thermal conditions provides information on which option is best suited.
View less