PCB header - MCDN 1,5/ 5-G1-3,81 P26THRR44
1708203

PCB headers, nominal cross section: 1.5 mm2, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Tin, type of contact: Male connector, number of potentials: 10, number of rows: 2, number of positions: 5, number of connections: 10, product range: MCDN 1,5/..-G1-THR, pitch: 3.81 mm, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: MINI COMBICON, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard


Detalii despre produs




Product line COMBICON Connectors S
Product type PCB headers
Number of positions 5
Pitch 3.81 mm
Number of connections 10
Number of rows 2
Mounting flange without
Number of potentials 10
Pin layout Linear pinning

Nominal current IN 8 A
Nominal voltage UN 160 V
Pollution degree 3
Contact resistance 2 mΩ
Rated voltage (III/3) 160 V
Rated surge voltage (III/3) 2.5 kV
Rated voltage (III/2) 160 V
Rated surge voltage (III/2) 2.5 kV

Mounting type THR soldering THR soldering
Mounting type THR soldering
Processing notes
Process Reflow/wave soldering
Moisture Sensitive Level MSL 1
Classification temperature Tc 260 °C
Solder cycles in the reflow 3

Material data - contact
Note WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact material Cu alloy
Surface characteristics Tin-plated
Metal surface contact area (top layer) Tin (3 - 5 µm Sn)
Metal surface contact area (middle layer) Nickel (1.3 - 3 µm Ni)
Metal surface soldering area (top layer) Tin (3 - 5 µm Sn)
Metal surface soldering area (middle layer) Nickel (1.3 - 3 µm Ni)
Material data - housing
Housing color black (9005)
Insulating material LCP
Insulating material group IIIa
CTI according to IEC 60112 175
Flammability rating according to UL 94 V0

Details for soldering processes Processing using reflow processes in compliance with IEC 60068-2-58 or DIN EN 61760-1 (latest version)
Moisture Sensitive Level (MSL) = 1 according to IPC/JEDEC J-STD-020-C

Desen dimensional
Width 20.4 mm
Height 17.8 mm
Installed height 15.2 mm
Length of the solder pin 2.6 mm
Length 13.3 mm
Length of the solder pin 2.6 mm
Pin dimensions 0.8 x 0.8 mm
Hole diameter 1.4 mm
Pitch 3.81 mm

Test for conductor damage and slackening
Specification IEC 60999-1:1999-11
Result Test passed
Repeated connection and disconnection
Specification IEC 60999-1:1999-11
Result Test passed
Pull-out test
Specification IEC 60999-1:1999-11
Conductor cross section/conductor type/tractive force setpoint/actual value 0.14 mm² / solid / > 10 N
0.14 mm² / flexible / > 10 N
1.5 mm² / solid / > 40 N
1.5 mm² / flexible / > 40 N
Insertion and withdrawal forces
Result Test passed
No. of cycles 25
Insertion strength per pos. approx. 8 N
Withdraw strength per pos. approx. 6 N
Contact holder in insert
Specification IEC 60512-15-1:2008-05
Contact holder in insert
Requirements >20 N
Test passed
Resistance of inscriptions
Specification IEC 60068-2-70:1995-12
Result Test passed
Polarization and coding
Specification IEC 60512-13-5:2006-02
Result Test passed
Visual inspection
Specification IEC 60512-1-1:2002-02
Result Test passed
Dimension check
Specification IEC 60512-1-2:2002-02
Result Test passed

Thermal test | Test group C
Specification IEC 60512-5-1:2002-02
Tested number of positions 20
Insulation resistance
Specification IEC 60512-3-1:2002-02
Insulation resistance, neighboring positions > 5 MΩ
Air clearances and creepage distances |
Specification IEC 60664-1:2007-04
Insulating material group IIIa
Comparative tracking index (IEC 60112) CTI 175
Rated insulation voltage (III/3) 160 V
Rated surge voltage (III/3) 2.5 kV
minimum clearance value - non-homogenous field (III/3) 1.5 mm
minimum creepage distance (III/3) 2.5 mm
Rated insulation voltage (III/2) 160 V
Rated surge voltage (III/2) 2.5 kV
minimum clearance value - non-homogenous field (III/2) 1.5 mm
minimum creepage distance (III/2) 1.6 mm
Rated insulation voltage (II/2) 250 V
Rated surge voltage (II/2) 2.5 kV
minimum clearance value - non-homogenous field (II/2) 1.5 mm
minimum creepage distance (II/2) 2.5 mm

Vibration test
Specification IEC 60068-2-6:2007-12
Frequency 10 - 150 - 10 Hz
Sweep speed 1 octave/min
Amplitude 0.35 mm (10 - 60.1 Hz)
Sweep speed 5g (60.1 - 150 Hz)
Test duration per axis 2.5 h
Durability test
Specification IEC 60512-9-1:2010-03
Impulse withstand voltage at sea level 2.95 kV
Contact resistance R1 2 mΩ
Contact resistance R2 2 mΩ
Insertion/withdrawal cycles 25
Insulation resistance, neighboring positions > 5 MΩ
Climatic test
Specification ISO 6988:1985-02
Corrosive stress 0.2 dm3 SO2 on 300 dm3/40 °C/1 cycle
Thermal stress 100 °C/168 h
Power-frequency withstand voltage 1.39 kV
Ambient conditions
Ambient temperature (operation) -40 °C ... 100 °C (dependent on the derating curve)
Ambient temperature (storage/transport) -40 °C ... 70 °C
Relative humidity (storage/transport) 30 % ... 70 %
Ambient temperature (assembly) -5 °C ... 100 °C

Type of packaging packed in cardboard

Număr articol 1708203
Unitate de ambalare 130 Bucată
Cantitate minimă pentru comandă 130 Bucată
Cod produs AABTHB
GTIN 4055626002101
Greutate pe bucată (inclusiv ambalajul) 6,938 g
Greutate pe bucată (fără ambalaj) 6,938 g
Cod tarifar vamal 85366930
Țara de origine BG


ECLASS

ECLASS-9.0 27440402
ECLASS-10.0.1 27440402
ECLASS-11.0 27460201

ETIM

ETIM 8.0 EC002637

UNSPSC

UNSPSC 21.0

IECEE CB Scheme

Approval Specification Data
Tensiune nominală UN Curent nominal IN Secțiune transversală AWG Secțiune transversală mm2
160 V 8 A

EAC

cULus Recognized

Approval Specification Data
Tensiune nominală UN Curent nominal IN Secțiune transversală AWG Secțiune transversală mm2
Use group B
150 V 8 A
Use group D
150 V 8 A

VDE report with production monitoring

Approval Specification Data
Tensiune nominală UN Curent nominal IN Secțiune transversală AWG Secțiune transversală mm2
160 V 8 A

China RoHS Environmentally friendly use period: unlimited = EFUP-e
No hazardous substances above threshold values

Avantajele dumneavoastră

Designed for integration into the SMT soldering process
Maximum flexibility when it comes to device design – one header for connectors with different connection technologies
Conductor connection on several levels enables higher contact density