PCB header - MCD 1,5/12-G1-3,81 BK
1962670

PCB headers, nominal cross section: 1.5 mm2, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Tin, type of contact: Male connector, number of potentials: 24, number of rows: 2, number of positions: 12, number of connections: 24, product range: MCD 1,5/..-G1, pitch: 3.81 mm, pin layout: Linear pinning, solder pin [P]: 3.5 mm, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard


Detalhes dos produtos




Product line COMBICON Connectors S
Product type PCB headers
Number of positions 12
Pitch 3.81 mm
Number of connections 24
Number of rows 2
Mounting flange without
Number of potentials 24
Pin layout Linear pinning

Nominal current IN 8 A
Nominal voltage UN 160 V
Pollution degree 3
Contact resistance 1.2 mΩ
Rated voltage (III/3) 160 V
Rated surge voltage (III/3) 2.5 kV
Rated voltage (III/2) 160 V
Rated surge voltage (III/2) 2.5 kV

Mounting type Wave soldering Wave soldering
Mounting type Wave soldering

Material data - contact
Note WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact material Cu alloy
Surface characteristics Tin-plated
Metal surface contact area (top layer) Tin (3 - 5 µm Sn)
Metal surface contact area (middle layer) Nickel (1 - 3 µm Ni)
Metal surface soldering area (top layer) Tin (3 - 5 µm Sn)
Metal surface soldering area (middle layer) Nickel (1 - 3 µm Ni)
Material data - housing
Housing color black (9005)
Insulating material PA
Insulating material group I
CTI according to IEC 60112 600
Flammability rating according to UL 94 V0
Glow wire flammability index GWFI according to EN 60695-2-12 850
Glow wire ignition temperature GWIT according to EN 60695-2-13 775
Temperature for the ball pressure test according to EN 60695-10-2 125 °C

Desenho cotado
Pitch 3.81 mm
47.11 mm
Height h 26.5 mm
Installed height 23 mm
Length l 21.9 mm
Solder pin length P 3.5 mm

Test for conductor damage and slackening
Specification IEC 60999-1:1999-11
Result Test passed
Pull-out test
Specification IEC 60999-1:1999-11
Conductor cross section/conductor type/tractive force setpoint/actual value 0.14 mm² / solid / > 7 N
0.14 mm² / flexible / > 7 N
1.5 mm² / solid / > 40 N
1.5 mm² / flexible / > 40 N
Insertion and withdrawal forces
Result Test passed
No. of cycles 25
Insertion strength per pos. approx. 8 N
Withdraw strength per pos. approx. 5 N
Torque test
Specification IEC 60999-1:1999-11
Contact holder in insert
Specification IEC 60512-15-1:2008-05
Contact holder in insert
Requirements >20 N
Test passed
Resistance of inscriptions
Specification IEC 60068-2-70:1995-12
Result Test passed
Polarization and coding
Specification IEC 60512-13-5:2006-02
Result Test passed
Visual inspection
Specification IEC 60512-1-1:2002-02
Result Test passed
Dimension check
Specification IEC 60512-1-2:2002-02
Result Test passed

Thermal test | Test group C
Specification IEC 60512-5-1:2002-02
Tested number of positions 16
Insulation resistance
Specification IEC 60512-3-1:2002-02
Insulation resistance, neighboring positions > 5 MΩ
Air clearances and creepage distances |
Specification IEC 60664-1:2007-04
Insulating material group I
Comparative tracking index (IEC 60112) CTI 600
Rated insulation voltage (III/3) 160 V
Rated surge voltage (III/3) 2.5 kV
minimum clearance value - non-homogenous field (III/3) 1.5 mm
minimum creepage distance (III/3) 2 mm
Rated insulation voltage (III/2) 160 V
Rated surge voltage (III/2) 2.5 kV
minimum clearance value - non-homogenous field (III/2) 1.5 mm
minimum creepage distance (III/2) 1.5 mm
Rated insulation voltage (II/2) 320 V
Rated surge voltage (II/2) 2.5 kV
minimum clearance value - non-homogenous field (II/2) 1.5 mm
minimum creepage distance (II/2) 1.6 mm

Vibration test
Specification IEC 60068-2-6:2007-12
Frequency 10 - 150 - 10 Hz
Sweep speed 1 octave/min
Amplitude 0.35 mm (10 - 60.1 Hz)
Sweep speed 5g (60.1 - 150 Hz)
Test duration per axis 2.5 h
Durability test
Specification IEC 60512-9-1:2010-03
Impulse withstand voltage at sea level 2.95 kV
Contact resistance R1 1.2 mΩ
Contact resistance R2 1.3 mΩ
Contact resistance R2 2nd level 2.2 mΩ
Insertion/withdrawal cycles 25
Insulation resistance, neighboring positions > 5 MΩ
Climatic test
Specification ISO 6988:1985-02
Corrosive stress 0.2 dm3 SO2 on 300 dm3/40 °C/1 cycle
Thermal stress 100 °C/168 h
Power-frequency withstand voltage 1.39 kV
Ambient conditions
Ambient temperature (operation) -40 °C ... 100 °C (dependent on the derating curve)
Ambient temperature (storage/transport) -40 °C ... 70 °C
Relative humidity (storage/transport) 30 % ... 70 %
Ambient temperature (assembly) -5 °C ... 100 °C

Type of packaging packed in cardboard

N.º de artigo 1962670
Pcs./Emb 50 Unidade
Quantidade mínima de pedido 50 Unidade
Chave comercial AAA
Chave de produto AABSHB
GTIN 4017918903176
Peso por unidade (inclusive embalagem) 15 g
Peso por unidade (excluindo embalagem) 13,589 g
Número do imposto alfandegário 85366930
País de origem DE


ECLASS

ECLASS-9.0 27440402
ECLASS-10.0.1 27440402
ECLASS-11.0 27460201

ETIM

ETIM 8.0 EC002637

UNSPSC

UNSPSC 21.0

CSA

Approval Specification Data
Tensão nominal UN Corrente nominal IN Secção transversal American Wire Gauge Secção transversal mm2
Use group B
300 V 8 A
Use group D
300 V 8 A

IECEE CB Scheme

Approval Specification Data
Tensão nominal UN Corrente nominal IN Secção transversal American Wire Gauge Secção transversal mm2
160 V 8 A

EAC

cULus Recognized

Approval Specification Data
Tensão nominal UN Corrente nominal IN Secção transversal American Wire Gauge Secção transversal mm2
Use group B
300 V 8 A
Use group D
300 V 8 A

VDE report with production monitoring

Approval Specification Data
Tensão nominal UN Corrente nominal IN Secção transversal American Wire Gauge Secção transversal mm2
160 V 8 A

China RoHS Environmentally friendly use period: unlimited = EFUP-e
No hazardous substances above threshold values

Vantagens

Well-known mounting principle allows worldwide use
Conductor connection on several levels enables higher contact density
Maximum flexibility when it comes to device design – one header for connectors with different connection technologies