News Overview

New headers for ME-IO housings

20.05.2018

New headers for ME-IO housings  

New headers for ME-IO housings

Phoenix Contact is expanding the range of connection technologies for electronics housings of the ME-IO series:

The new PCB headers of high-temperature LCP plastic, suitable for THR soldering, are ideally suited for integration into the SMT process. The headers, with pitches of 3.45 mm and 5.0 mm, each feature two or three slots for PCB connectors with pitches of 1.5 mm and 2.5 mm. As a result, there are now fully equipped headers available for reflow-soldering for the 4- and 6-pos. connectors, as well as fully and partially equipped versions for wave soldering. The new PCB headers are designed for currents up to 8 A and voltages up to 320 V.


PHOENIX CONTACT
SEA Pte. Ltd.

105 Eunos Avenue 3
#04-00
Singapore 409836
+65 6228 4900