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Passive heatsinks for ICS series electronics housings – for thermally demanding applications

Passive heatsinks for ICS series electronics housings for thermally demanding applications  

Phoenix Contact is enhancing the versatility of its electronics housings. Passive heatsinks for the ICS series enable the finished devices to be used even in thermally demanding applications. Extensive thermal simulations also support you in optimizing your printed circuit board layout.

Your advantages

  • Heatsinks enable the finished devices to be used in thermally demanding applications
  • Extensive thermal simulations help achieve the optimum arrangement of components on the printed circuit board
  • Customized heatsinks for reliable heat dissipation
  • Simplified engineering process: all the services needed for your specific device design

Main features

  • Material: aluminum
  • Overall width: 50 mm
  • Height: 100 and 122 mm
  • Application-specific adjustments for different electronic components
  • Easy push-in mounting

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PHOENIX CONTACT
SEA Pte. Ltd.

105 Eunos Avenue 3
#04-00
Singapore 409836
+65 6228 4900

Configurators

Configure products and solutions for your individual application.

Electronics housings
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