News Overview

New headers for ME-IO housings

17.05.2018

New headers for ME-IO housings

[5009] Phoenix contact is expanding the connection technology portfolio of ME-IO series electronics housings:

The new PCB headers of high-temperature LCP plastic, suitable for THR soldering, are ideally suited for integration into the SMT process.

The headers, with pitches of 3.45 mm and 5.0 mm, each feature two or three slots for PCB connectors with pitches of 1.5 mm and 2.5 mm. As a result, there are now fully equipped headers available for reflow-soldering for the 4- and 6-pos. connectors, as well as fully and partially equipped versions for wave soldering. The PCB headers are designed for currents up to 8 A and voltages up to 320 V.


PHOENIX CONTACT
GmbH & Co. KG

Corporate Communications
Flachsmarktstr. 8
D-32825 Blomberg
+49 5235 3-41240

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