SMD male connector, nominal current: 2.2 A, test voltage: 840 V AC, number of positions: 26, pitch: 1.27 mm, color: black, contact surface: Au, contact connection type: Pin, mounting: SMD soldering
| Product type | SMD male connector |
| Product family | FR 1,27/...-MV 3,25 |
| Number of positions | 26 |
| Pitch | 1.27 mm |
| Number of rows | 2 |
| Pin layout | Linear pad geometry |
| Properties | |
| Nominal current IN | 2.2 A IEC 60512-5-2:2002-02 (at 20°C 100-pos.) |
| Contact resistance | 10 mΩ |
| Test voltage | 840 V AC IEC 60512-4-1:2003-05 |
| Data transmission | |
| Data transmission rate | 12 Gbps |
| Mounting type | SMD soldering |
| Pin layout | Linear pad geometry |
| Processing notes | |
| Process | Reflow soldering |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
| Solder cycles in the reflow | 3 |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Selective coating |
| Metal surface contact area (top layer) | Gold (min. 0.5 µm Au) |
| Metal surface contact area (middle layer) | Nickel (1.27 µm - 4 µm Ni) |
| Metal surface soldering area (top layer) | Tin (3 µm - 6 µm Sn) |
| Metal surface soldering area (middle layer) | Nickel (1.27 µm - 4 µm Ni) |
| Material data - housing | |
| Color (Housing) | black (9005) |
| Insulating material | LCP |
| Insulating material group | IIIb |
| CTI according to IEC 60112 | 150 |
| Flammability rating according to UL 94 | V0 |
| Notes on operation | The permissible voltage during operation depends on the application, taking into consideration the air clearances and creepage distances within the scope of insulation requirements in accordance with IEC 60664-1. |
| Dimensional drawing |
|
| Pitch | 1.27 mm |
| Width [w] | 21.6 mm |
| Height [h] | 9 mm |
| Length [l] | 7.2 mm |
| Installed height | 8.25 mm |
| Application | |
| Contact cover | 0.9 mm |
| Center offset | ± 0.7 mm in longitudinal and transverse direction |
| Stack height | 9.5 mm Tolerance: +1,5 mm (in combination with Range of articles:FR 1,27/...-FV 6,25) |
| 12.3 mm Tolerance: +1,5 mm (in combination with Range of articles:FR 1,27/...-FV 9,05) | |
| Wipe length | 1.5 mm |
| Angular tolerance | ± 5 ° in longitudinal and transverse direction |
| PCB design | |
| Pad geometry | 0.8 x 1.1 mm |
| Thermal test | Test group C | |
| Specification | IEC 60512-5-2:2002-02 |
| Insulation resistance | |
| Specification | IEC 60512-3-1:2002-02 |
| Insulation resistance, neighboring positions | ≥ 5 GΩ |
| Air clearances and creepage distances | | |
| Insulating material group | IIIb |
| Minimum value for clearance and creepage distance | 0.56 mm |
| Durability test | |
| Specification | IEC 60512-9-1:2010-03 (following) |
| Contact resistance R1 | 10 mΩ |
| Contact resistance R2 | 15 mΩ |
| Insertion/withdrawal cycles | 500 |
| Insulation resistance, neighboring positions | ≥ 5 GΩ |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 2000 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 1.5 mm (10 Hz ... 58 Hz) |
| Acceleration | 200 m/s² (58 Hz ... 2000 Hz) |
| Test duration per axis | 2.5 h |
| Test directions | X-, Y- and Z-axis |
| Shocks | |
| Specification | IEC 60068-2-27:2008-02 |
| Pulse shape | Semi-sinusoidal |
| Acceleration | 490 m/s² |
| Shock duration | 11 ms |
| Test directions | X-, Y- and Z-axis (pos. and neg.) |
| Railway application: Oscillation/broadband noise | |
| Specification | DIN EN 50155 (VDE 0115-200):2022-06 |
| IEC 61373:2010-05 | |
| Spectrum | Long life test category 2, bogie-mounted |
| Frequency | f1 = 5 Hz to f2 = 250 Hz |
| ASD level | 6.12 (m/s²)²/Hz |
| Acceleration | 30.6 m/s² |
| Test duration per axis | 5 h |
| Test directions | X-, Y- and Z-axis |
| Contact interruption | < 1 µs |
| Result | Test passed |
| Railway application: Shocks | |
| Specification | DIN EN 50155 (VDE 0115-200):2022-06 |
| IEC 61373:2010-05 | |
| Pulse shape | Semi-sinusoidal |
| Acceleration | 490 m/s² |
| Shock duration | 11 ms |
| Number of shocks per direction | 3 |
| Test directions | X-, Y- and Z-axis (pos. and neg.) |
| Contact interruption | < 1 µs |
| Result | Test passed |
| Ambient conditions | |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Ambient temperature (operation) | -55 °C ... 125 °C |
| Dimensional drawing |
|
| Type of packaging | 44 mm wide tape |
| [W] tape width | 44 mm |
| [W2] coil overall dimension | ≤ 50.4 mm |
| [A] coil diameter | ≤ 330 mm |
| Outer packaging type | Transparent-Bag |
| Nimellisjännite UN | Nimellisvirta IN | Poikkipinta AWG | Poikkipinta mm2 | |
|---|---|---|---|---|
| keine | ||||
| 29.9 V | 1.4 A | |||
| Nimellisjännite UN | Nimellisvirta IN | Poikkipinta AWG | Poikkipinta mm2 | |
|---|---|---|---|---|
| keine | ||||
| 29.9 V | 2 A | |||
Can I get specific versions for my individual application?
Yes, in addition to our standard items, we also develop customer-specific versions for connecting PCBs within the device. Customer-specific versions range from different position number versions and modified gold layer thicknesses to extended stack h... Näytä lisää
Yes, in addition to our standard items, we also develop customer-specific versions for connecting PCBs within the device. Customer-specific versions range from different position number versions and modified gold layer thicknesses to extended stack heights and completely new designs. We will be happy to advise you on the design and implementation of your requirements.
Näytä vähemmänWhat makes the board-to-board connector FR 1,27 so special?
The FR 1,27 series offers improved product properties in a standard market format - an innovation within the form-fit-function specifications. The high-quality contact design enables a current transmission of 2.3 A per contact (50-pos. at 20°C) and h... Näytä lisää
The FR 1,27 series offers improved product properties in a standard market format - an innovation within the form-fit-function specifications. The high-quality contact design enables a current transmission of 2.3 A per contact (50-pos. at 20°C) and high-speed data transmission of up to 28 Gbps. The number of different positions ranges from 6 ... 100, offering high flexibility for the device design.
Näytä vähemmänCan I also achieve higher nominal currents than 2.3 A per contact?
Yes, the nominal current is 2.3 A per contact for a fully energized, 50-pos. connector at an ambient temperature of 20°C. With effective energization of six positions, up to 3.7 A per contact is possible. The derating curve in accordance with IEC 605... Näytä lisää
Yes, the nominal current is 2.3 A per contact for a fully energized, 50-pos. connector at an ambient temperature of 20°C. With effective energization of six positions, up to 3.7 A per contact is possible. The derating curve in accordance with IEC 60512-5-2 shows the temperature-dependent current carrying capacity for different numbers of positions. We are happy to support you with the individual consideration of your application.
Näytä vähemmänI am currently using a 1.27 mm pitch board-to-board connector from another manufacturer. Is it possible to switch to FR 1,27?
Yes, the FR 1,27 series is layout- and plug-in compatible with standard connectors from other manufacturers. It is ideal as a second source. Test reports are available on request.
In which numbers of positions is the FR 1,27 series board-to-board connector available?
The FR 1,27 connector is available in the following numbers of positions: 6, 12, 16, 20, 26, 32, 40, 50, 68, 80, and 100.
The IDC female connector strips are available in 12-, 16-, 20-, 26-, 32-, 40-, 50-, 68-, and 80-position versions.
Does the specified data transmission rate apply to all combinations?
No, the specified data transmission rate refers to an example combination. It may vary depending on the item combination. Factors such as different stack heights - due to longer or shorter contacts - influence the signal quality and thus the achievab... Näytä lisää
No, the specified data transmission rate refers to an example combination. It may vary depending on the item combination. Factors such as different stack heights - due to longer or shorter contacts - influence the signal quality and thus the achievable data rate. We can work with you to optimize high-speed data transmission for individual applications. Feel free to contact us.
Näytä vähemmänWhere is position 1?
Position a1 (row a, pin 1) is marked on the item. Position 1 is also marked in the TecDoc drawings (product family drawing and packaging drawing). The orientation of the item for PCB assembly and the plug-in direction are thus clearly defined. The cu... Näytä lisää
Position a1 (row a, pin 1) is marked on the item. Position 1 is also marked in the TecDoc drawings (product family drawing and packaging drawing). The orientation of the item for PCB assembly and the plug-in direction are thus clearly defined. The customer can provide a different definition in its own documentation.
Näytä vähemmänWhere can I find information on extended air clearances and creepage distances to realize the necessary voltage requirements in my application?
The minimum distances are specified in the technical data. We are happy to calculate distances for partially assembled connectors or between omitted pins (so-called death metal parts) on request. This means that increased voltage requirements can also be realized.
Where can I find out more about board-to-board connectors?
You can find white papers, new products, product information, videos, etc., under ’Board-to-board connectors’ in the ’Products’ section of our website. Download the ‘FINEPITCH board-to-board connectors’ brochure as an e-paper. This provides details o... Näytä lisää
You can find white papers, new products, product information, videos, etc., under ’Board-to-board connectors’ in the ’Products’ section of our website. Download the ‘FINEPITCH board-to-board connectors’ brochure as an e-paper. This provides details on applications, contact systems, and the technical properties of the products. It also provides information on data transmission, electromagnetic compatibility (EMC), and the SMD soldering process.
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