Universal housings - UCS 125-87-F-GD 7035

Complete housing for PCBs, can be positioned flexibly; includes housing half shells, side panels closed, adhesive pads for PCB attachment, screws for housing and PCB attachment; housing color: light gray, with turquoise-blue corner inlays

Product Details

Assembly instruction: The housing can be opened a maximum of 10 times.
Note on application Attach the adhesive pads: Make sure that the surface of the housing is clean, dry, and free of grease. Temperature range: +18°C  ... +30°C / Closing pressure force: 60 N / Closing pressure time: 3 s

Product type Complete housing
Type Flat design (GD)
Housing type Universal housings
Ventilation openings present no
Housing series UCS

Dimensional drawing
Width 125 mm
Height 87 mm
Depth 47 mm
Dimensions 100 mm x 62 mm (Maximum circuit board dimensions)
PCB design
PCB thickness 0.8 mm ... 3 mm

Color light grey (7035)
Flammability rating according to UL 94 V0
CTI according to IEC 60112 225
Insulating material PC
Surface characteristics untreated
Housing material PC

Power dissipation single housing for 20 °C
Ambient temperature 20 °C
Reduction factor 1
Mounting position vertical
Power dissipation 9.7 W
Power dissipation single housing for 30 °C
Ambient temperature 30 °C
Reduction factor 0.85
Mounting position vertical
Power dissipation 8.3 W
Power dissipation single housing for 40 °C
Ambient temperature 40 °C
Reduction factor 0.68
Mounting position vertical
Power dissipation 6.5 W
Power dissipation single housing for 50 °C
Ambient temperature 50 °C
Reduction factor 0.55
Mounting position vertical
Power dissipation 5.4 W
Power dissipation single housing for 60 °C
Ambient temperature 60 °C
Reduction factor 0.4
Mounting position vertical
Power dissipation 3.9 W
Vibration test
Specification IEC 60068-2-6:2007-12
Frequency 10 - 150 - 10 Hz
Sweep speed 1 octave/min
Amplitude 0.15 mm (10 - 58.1 Hz)
Acceleration 2g (58.1 - 150 Hz)
Test duration per axis 2.5 h
Test directions X-, Y- and Z-axis
Glow-wire test
Specification DIN EN 60695-2-11 (VDE 0471-2-11):2014-11
Temperature 850 °C
Time of exposure 30 s
Thermal stability / ball thrust test
Specification IEC 60695-10-2:2014-02
Temperature 125 °C
Test duration 1 h
Force 20 N
Mechanical strength / tumbling barrel
Specification IEC 60068-2-31:2008-05
Height of fall 50 cm
Frequency 50
Specification IEC 60068-2-27:2008-02
Pulse shape Half-sine
Acceleration 15g
Shock duration 11 ms
Number of shocks per direction 3
Test directions X-, Y- and Z-axis (pos. and neg.)
Test for substances that would hinder coating with paint or varnish
Specification VW PV 3.10.7:2005-02
Result Test passed
Degree of protection (IP code)
Specification IEC 60529:1989-11 + AMD 1:1999-11 + AMD 2:2013-08
Result, degree of protection, IP code IP40
Ambient conditions
Max. IP code to attain IP40
Ambient temperature (operation) -40 °C ... 105 °C (depending on power dissipation)
Ambient temperature (storage/transport) -40 °C ... 55 °C
Ambient temperature (assembly) -5 °C ... 100 °C
Relative humidity (storage/transport) 80 %

Number of PCB holders 1
Type of PCB mount Bolt mounting
Total PCB surface 6000 mm²
Thickness of the PCB 0.8 mm ... 3 mm
Supported form factors Raspberry Pi
Note on PCB holders This product is prepared for a printed-circuit board. Additional printed-circuit boards can be mounted using adhesive pads (accessories).

Mounting type Screw mounting
Mounting position any
Tightening torque / speed Screw connection between housing halves: 1.2 Nm-1.4 Nm / 500 rpm-1000 rpm
Mounting the PCB: 0.4 Nm-0.5 Nm / 500 rpm-1000 rpm

Type of packaging Box packaging

Item number 2203328
Packing unit 1 pc
Minimum order quantity 1 pc
Sales Key ACF
Product Key ACFCAA
GTIN 4055626404400
Weight per Piece (including packing) 302,3 g
Weight per Piece (excluding packing) 142,77 g
Customs tariff number 85389099
Country of origin DE


ECLASS-9.0 27182702
ECLASS-10.0.1 27182702
ECLASS-11.0 27182702


ETIM 8.0 EC001031


UNSPSC 21.0 31261500


Approval ID: B.01687

UL Recognized

Approval ID: FILE E 240868

Your advantages

High degree of application flexibility, thanks to the modular housing design
Flexible PCB attachment, adapts to virtually all form factors
Practical customization options
Reduced logistics outlay, thanks to components which are compatible with one another