FP 1,27/ 12-MH
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SMD male connectors
1714912
SMD male connector, nominal current: 1.4 A, Test voltage: 500 V AC, number of positions: 12, pitch: 1.27 mm, color: black, contact surface: Gold, contact connection type: Pin, mounting: SMD soldering
Product details
| Product type | SMD male connector |
| Product family | FR 1,27/...-MH |
| Number of positions | 12 |
| Pitch | 1.27 mm |
| Number of rows | 2 |
| Number of potentials | 12 |
| Pin layout | Linear pad geometry |
| Nominal current IN | 1.4 A IEC 60512-5-2:2002-02 (at 20°C 50-pos.) |
| Nominal voltage UN | AC |
| Degree of pollution | 3 |
| Contact resistance | 25 mΩ |
| Test voltage | 500 V AC IEC 60512-4-1:2003 |
| Rated voltage (III/3) | 500 V |
| Rated voltage (II/2) | 10 V |
| Rated surge voltage (II/2) | 0.8 kV |
| Mounting type | SMD soldering |
| Pin layout | Linear pad geometry |
| Processing notes | |
| Process | Reflow soldering |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Selective coating |
| Metal surface contact area (top layer) | Gold (Au) |
| Metal surface contact area (middle layer) | Nickel (Ni) Palladium nickel, (PdNi) |
| Metal surface soldering area (top layer) | Tin (Sn) |
| Material data - housing | |
| Color (Housing) | black (9005) |
| Insulating material | LCP |
| Insulating material group | IIIb |
| CTI according to IEC 60112 | 175 |
| Flammability rating according to UL 94 | V0 |
| Notes on operation | The permissible voltage during operation depends on the application, taking into consideration the air clearances and creepage distances within the scope of insulation requirements in accordance with IEC 60664-1. |
| Dimensional drawing |
|
| Pitch | 1.27 mm |
| Width [w] | 12.71 mm |
| Height [h] | 5 mm |
| Length [l] | 7.2 mm |
| Installed height | 4.2 mm |
| Application | |
| Contact cover | 0.9 mm |
| Center offset | ± 0.7 mm in longitudinal and transverse direction |
| Wipe length | 1.5 mm |
| Angular tolerance | ± 4 ° in longitudinal direction |
| ± 2 ° in transverse direction | |
| PCB design | |
| Pad geometry | 0.8 x 0.8 mm |
| Pin spacing | 1.27 mm |
| Insertion and withdrawal forces | |
| Result | Test passed |
| No. of cycles | 500 |
| Insertion strength per pos. approx. | 0.5 N |
| Withdraw strength per pos. approx. | 0.5 N |
| Resistance of inscriptions | |
| Specification | IEC 60068-2-70:1995-12 |
| Result | Test passed |
| Visual inspection | |
| Specification | IEC 60512-1-1:2002-02 |
| Result | Test passed |
| Dimension check | |
| Specification | IEC 60512-1-2:2002-02 |
| Result | Test passed |
| Thermal test | Test group C | |
| Specification | IEC 60512-5-2:2002-02 |
| Tested number of positions | 50 |
| Insulation resistance | |
| Specification | IEC 60512-3-1:2002-02 |
| Insulation resistance, neighboring positions | ≥ 10 GΩ |
| Air clearances and creepage distances | | |
| Insulating material group | IIIb |
| Comparative tracking index (IEC 60112) | CTI 175 |
| Rated insulation voltage (III/3) | 500 V |
| Rated insulation voltage (II/2) | 10 V |
| Rated surge voltage (II/2) | 0.8 kV |
| minimum clearance value - non-homogenous field (II/2) | 0.4 mm |
| minimum creepage distance (II/2) | 0.4 mm |
| Minimum value for clearance and creepage distance | 0.4 mm |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 2000 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 1.5 mm (10 Hz ... 60.1 Hz) |
| Sweep speed | 20g (60.1 Hz ... 2000 Hz) |
| Test duration per axis | 2.5 h |
| Durability test | |
| Specification | IEC 60512-9-1:2010-03 (following) |
| Impulse withstand voltage at sea level | 0.8 kV |
| Contact resistance R1 | 25 mΩ |
| Contact resistance R2 | 25 mΩ |
| Insertion/withdrawal cycles | 500 |
| Insulation resistance, neighboring positions | ≥ 10 GΩ |
| Climatic test | |
| Specification | IEC 60512-11-7:2003-05 |
| Corrosive stress | Method 1, 10 days |
| Power-frequency withstand voltage | 500 V AC |
| Shocks | |
| Specification | IEC 60068-2-27:2008-02 |
| Pulse shape | Semi-sinusoidal |
| Acceleration | 50g |
| Shock duration | 11 ms |
| Test directions | X-, Y- and Z-axis (pos. and neg.) |
| Ambient conditions | |
| Ambient temperature (operation) | -55 °C ... 125 °C |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Dimensional drawing |
|
| Type of packaging | 24 mm wide tape |
| [W] tape width | 24 mm |
| [W2] coil overall dimension | 30.4 mm |
| [A] coil diameter | 330 mm |
| Outer packaging type | Transparent-Bag |
| ESD level | (D) electrostatically conductive |
| Specification | DIN EN 61340-5-1 (VDE 0300-5-1): 2008-07 |
Your advantages
Gold-plated contacts ensure transfer quality remains stable over the long term
Compact, high-position board-to-board or wire-to-board connectors for space-saving device designs
Stacked, coplanar or orthogonal PCB connections enable maximum flexibility in the device
Male and female connectors of different height can be combined – for individual PCB spacing of 8 mm ... 13.8 mm