cULus Recognized
Approval ID: E118976-20230512| Nominal Voltage UN | Nominal Current IN | Cross Section AWG | Cross Section mm2 | |
|---|---|---|---|---|
| 29.9 V | 0.5 A |
FS 0,635/ 80-FV-R- 4,0
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SMD female connectors
1333899
SMD female connector, nominal current: 0.5 A, Test voltage: 500 V AC, number of positions: 80, pitch: 0.635 mm, color: black, contact surface: Gold, type of contact: Socket, mounting: SMD soldering
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Mandatory Accessories
Product Details
| Product type | SMD female connector |
| Product family | FS 0,635/...-FV-R- 4,0 |
| Number of positions | 80 |
| Pitch | 0.635 mm |
| Number of rows | 2 |
| Pin layout | Linear pad geometry |
| Nominal current IN | 0.5 A IEC 60512-5-2:2002-02 (40-pos. / 60-pos.) |
| Degree of pollution | 3 |
| Contact resistance | 40 mΩ |
| Test voltage | 500 V AC IEC 60512-4-1:2003 |
| Rated voltage (I/1) | 125 V |
| Rated surge voltage (I/1) | 0.8 kV |
| Mounting type | SMD soldering |
| Pin layout | Linear pad geometry |
| Processing notes | |
| Process | Reflow soldering |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
| Solder cycles in the reflow | 3 |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Selective coating |
| Metal surface contact area (top layer) | Gold (Au) |
| Metal surface contact area (middle layer) | Nickel (Ni) |
| Metal surface soldering area (top layer) | Tin (Sn) |
| Metal surface soldering area (middle layer) | Nickel (Ni) |
| Material data - housing | |
| Color (Housing) | black (9005) |
| Insulating material | LCP |
| Insulating material group | IIIb |
| CTI according to IEC 60112 | 160 |
| Flammability rating according to UL 94 | V0 |
| Material data – actuating element | |
| Color () | () |
| Notes on operation | The permissible voltage during operation depends on the application, taking into consideration the air clearances and creepage distances within the scope of insulation requirements in accordance with IEC 60664-1. |
| Dimensional drawing |
|
| Pitch | 0.635 mm |
| Width [w] | 33.27 mm |
| Height [h] | 4.6 mm |
| Length [l] | 6.4 mm |
| Installed height | 4 mm |
| Application | |
| Contact cover | 0.6 mm |
| Center offset | ± 0.5 mm in longitudinal and transverse direction |
| Stack height | 6 mm Tolerance: +0.6 mm (in combination with Range of articles:FS 0,635-MV-R- 5,0) |
| 9 mm Tolerance: +0.6 mm (in combination with Range of articles:FS 0,635-MV-R- 8,0) | |
| 10 mm Tolerance: +0.6 mm (in combination with Range of articles:FS 0,635-MV-R- 9,0) | |
| Wipe length | 0.6 mm |
| Angular tolerance | ± 10 ° in longitudinal and transverse direction (when plugging in) |
| ± 2 ° in longitudinal and transverse direction (when plugged in) | |
| PCB design | |
| Pad geometry | 0.35 x 2.5 mm |
| Thermal test | Test group C | |
| Specification | IEC 60512-5-2:2002-02 |
| Tested number of positions | 60 |
| Insulation resistance | |
| Specification | IEC 60512-3-1:2002-02 |
| Insulation resistance, neighboring positions | ≥ 5 GΩ |
| Air clearances and creepage distances | | |
| Specification | IEC 60664-1:2007-04 |
| Insulating material group | IIIb |
| Minimum value for clearance and creepage distance | 0.19 mm |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 55 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 1.52 mm |
| Sweep speed | 181 m/s² |
| Test duration per axis | 2 h |
| Durability test | |
| Specification | IEC 60512-9-1:2010-03 (following) |
| Contact resistance R1 | 40 mΩ |
| Contact resistance R2 | 40 mΩ |
| Insertion/withdrawal cycles | 50 |
| Insulation resistance, neighboring positions | ≥ 5 GΩ |
| Climatic test | |
| Specification | IEC 60068-2-60:2015-06 |
| Corrosive stress | Method 4, 10 days |
| Thermal stress | 125 °C/168 h |
| Power-frequency withstand voltage | 500 V |
| Ambient conditions | |
| Ambient temperature (operation) | -55 °C ... 125 °C |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Dimensional drawing |
|
| Type of packaging | 56 mm wide tape |
| [W] tape width | 56 mm |
| [W2] coil overall dimension | 62.4 mm |
| [A] coil diameter | 330 mm |
| Outer packaging type | Transparent-Bag |
| ESD level | (D) electrostatically conductive |
| Specification | DIN EN 61340-5-1 (VDE 0300-5-1): 2008-07 |
Your advantages
Design-in support during device development through M-CAD/E-CAD data and a free sample service
Cost and space savings with the comprehensive portfolio available in various stack heights
Easy mating with integrated keyways and tolerance compensation for error-free production
High-speed data transmission up to 20 Gbps for various possible applications
Time savings during the development process with customer-specific simulations for data integrity
Gold-plated contacts ensure transfer quality remains stable over the long term