The first high-speed data transmission at up to 28 Gbps using the established market standard, opens up new design possibilities.
Robust 6-pos. to 100-pos. board-to-board and wire-to-board connectors ensure greater flexibility with regard to component options.
Time savings during the development process with customer-specific simulations for data integrity.
Gold-plated contact points enable long-term stable signal transmission and currents of up to 2.3 A.
Design-in support during device development using MCAD/ECAD data and a free sample service.