PCB header - MCV 1,5/ 8-GFL-3,5 THT
1963065

PCB headers, nominal cross section: 1.5 mm2, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Tin, type of contact: Male connector, number of potentials: 8, number of rows: 1, number of positions: 8, number of connections: 8, product range: MCV 1,5/..-GFL-THT, pitch: 3.5 mm, pin layout: Linear pinning, number of solder pins per potential: 1, plug-in system: MINI COMBICON, Pin connector pattern alignment: Standard, locking: Screw locking, mounting: Threaded flange, type of packaging: packed in cardboard, Two-in-one – Pin strips must always be made up of a left (L) and a right (R) segment. Please allow for the corresponding counterpart from the accessories to complete the THR pin strip. User information and design recommendations on Through Hole Reflow Technology can be found at: "Downloads".


Product Details




Type Component suitable for through hole reflow
Product line COMBICON Connectors S
Product type PCB headers
Number of positions 8
Pitch 3.5 mm
Number of connections 8
Number of rows 1
Mounting flange Threaded flange
Number of potentials 8
Pin layout Linear pinning

Nominal current IN 8 A
Nominal voltage UN 160 V
Pollution degree 3
Rated voltage (III/3) 160 V
Rated surge voltage (III/3) 2.5 kV
Rated voltage (III/2) 160 V
Rated surge voltage (III/2) 2.5 kV

Mounting type THR soldering THR soldering
Mounting type THR soldering
Tightening torque 0.3 Nm

Material data - contact
Note WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact material Cu alloy
Surface characteristics Tin-plated
Metal surface contact area (top layer) Tin (3 - 5 µm Sn)
Metal surface contact area (middle layer) Nickel (1.3 - 3 µm Ni)
Metal surface soldering area (top layer) Tin (3 - 5 µm Sn)
Metal surface soldering area (middle layer) Nickel (1.3 - 3 µm Ni)
Material data - housing
Housing color black (9005)
Insulating material PA
Insulating material group IIIa
CTI according to IEC 60112 250
Flammability rating according to UL 94 V0
Glow wire flammability index GWFI according to EN 60695-2-12 850
Glow wire ignition temperature GWIT according to EN 60695-2-13 775
Temperature for the ball pressure test according to EN 60695-10-2 125 °C

Dimensional drawing
Height 9.2 mm
Installed height 10 mm
Length 7.25 mm
Pin dimensions 0.8 x 0.8 mm
Hole diameter 1.3 mm
Pitch 3.5 mm
PCB design
Pin spacing 3.50 mm

Air clearances and creepage distances |
Specification IEC 60664-1:2007-04
Insulating material group IIIa
Comparative tracking index (IEC 60112) CTI 250
Rated insulation voltage (III/3) 160 V
Rated surge voltage (III/3) 2.5 kV
minimum clearance value - non-homogenous field (III/3) 1.5 mm
minimum creepage distance (III/3) 2.5 mm
Rated insulation voltage (III/2) 160 V
Rated surge voltage (III/2) 2.5 kV
minimum clearance value - non-homogenous field (III/2) 1.5 mm
minimum creepage distance (III/2) 1.6 mm
Rated insulation voltage (II/2) 250 V
Rated surge voltage (II/2) 2.5 kV
minimum clearance value - non-homogenous field (II/2) 1.5 mm
minimum creepage distance (II/2) 2.5 mm

Ambient conditions
Ambient temperature (operation) -40 °C ... 100 °C (dependent on the derating curve)
Ambient temperature (storage/transport) -40 °C ... 70 °C
Relative humidity (storage/transport) 30 % ... 70 %
Ambient temperature (assembly) -5 °C ... 100 °C

Type of packaging packed in cardboard
Outer packaging type Dry bag

Item number 1963065
Packing unit 50 pc
Minimum order quantity 50 pc
Note Made to Order (non-returnable)
Sales Key 0517*
Product Key AAB1GK
Catalog Page Page 97 (CC-2005)
GTIN 4017918916237
Weight per Piece (including packing) 3.79 g
Weight per Piece (excluding packing) 1.98 g
Customs tariff number 85366930
Country of origin DE


ECLASS

ECLASS-9.0 27440402
ECLASS-10.0.1 27440402
ECLASS-11.0 27460201

ETIM

ETIM 8.0 EC002637

UNSPSC

UNSPSC 21.0

EAC

cULus Recognized

Approval Specification Data
Nominal Voltage UN Nominal Current IN Cross Section AWG Cross Section mm2
Use group B
300 V 8 A
Use group D
300 V 8 A

China RoHS Environmentally friendly use period: unlimited = EFUP-e
No hazardous substances above threshold values

Your advantages

Designed for integration into the SMT soldering process
Vertical connection enables multi-row arrangement on the PCB
Maximum flexibility when it comes to device design – one header for connectors with different connection technologies