PCB terminal block - MKDS 1/ 4-3,81 HTBKR24 NZ19001
1991817

PCB terminal block, nominal current: 13.5 A, rated voltage (III/2): 200 V, nominal cross section: 1.5 mm2, number of potentials: 4, number of rows: 1, number of positions per row: 4, product range: MKDS 1/..-HT, pitch: 3.81 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, conductor/PCB connection direction: 0 °, color: black, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins per potential: 1, type of packaging: 24 mm wide tape


Product Details




Type PC termination block
Product line COMBICON Terminals S
Product type Printed circuit board terminal
Number of positions 4
Pitch 3.81 mm
Number of connections 4
Number of rows 1
Number of potentials 4
Pin layout Linear pinning

Nominal current IN 13.5 A
Nominal voltage UN 200 V
Pollution degree 3
Rated voltage (III/3) 63 V
Rated surge voltage (III/3) 2.5 kV
Rated voltage (III/2) 200 V
Rated surge voltage (III/2) 2.5 kV

Connection technology
Type PC termination block
Nominal cross section 1.5 mm²
Conductor connection
Connection method Screw connection with tension sleeve
Conductor cross section solid 0.14 mm² ... 1.5 mm²
Conductor cross section flexible 0.14 mm² ... 1.5 mm²
Conductor cross section AWG 26 ... 16
Conductor cross section flexible, with ferrule without plastic sleeve 0.25 mm² ... 0.5 mm²
Conductor cross section, flexible, with ferrule, with plastic sleeve 0.25 mm² ... 0.5 mm²
2 conductors with same cross section, solid 0.14 mm² ... 0.5 mm²
2 conductors with same cross section, flexible 0.14 mm² ... 0.34 mm²
Stripping length 5 mm
Torque 0.22 Nm ... 0.25 Nm

Mounting type THR soldering THR soldering
Mounting type THR soldering
Drive form screw head Slotted (L)
Processing notes
Process Reflow/wave soldering
Moisture Sensitive Level MSL 3
Classification temperature Tc 260 °C
Solder cycles in the reflow 3

Material data - contact
Note WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact material Cu alloy
Surface characteristics Tin-plated
Metal surface terminal point (top layer) Tin (5 - 7 µm Sn)
Metal surface terminal point (middle layer) Nickel (2 - 3 µm Ni)
Metal surface soldering area (top layer) Tin (5 - 7 µm Sn)
Metal surface soldering area (middle layer) Nickel (2 - 3 µm Ni)
Material data - housing
Housing color black (9005)
Insulating material PA
Insulating material group IIIa
CTI according to IEC 60112 325
Flammability rating according to UL 94 V0

Note on application For safe conductor connection, always adhere to a defined tightening torque. Particularly in the case of PCB terminal blocks with two or three positions, the individual solder pin for each contact point cannot compensate for this. That is why the terminal blocks must be supported during conductor connection (held with one hand, support on the housing).

Dimensional drawing
Width 15.23 mm
Height 12 mm
Installed height 8.5 mm
Length of the solder pin 3.5 mm
Length 7.3 mm
Length of the solder pin 3.5 mm
Pin dimensions 0.5 x 0.9 mm
Hole diameter 1.1 mm
Pitch 3.81 mm
PCB design
Pin spacing 3.5 mm

Test for conductor damage and slackening
Specification IEC 60998-2-1:1990-04
Result Test passed
Pull-out test
Specification IEC 60998-2-1:1990-04
Conductor cross section/conductor type/tractive force setpoint/actual value 0.14 mm² / solid / > 10 N
0.14 mm² / flexible / > 10 N
1.5 mm² / solid / > 40 N
1 mm² / flexible / > 35 N
Torque test
Specification IEC 60998-2-1:1990-04

Temperature-rise test
Specification IEC 60998-1:2002-12
Requirement temperature-rise test Increase in temperature ≤ 45 K
Insulation resistance
Specification IEC 60998-2-1:1990-04
Insulation resistance, neighboring positions 109 Ω
Air clearances and creepage distances |
Specification IEC 60947-1:2007-06 + A1:2010-12 + A2:2014-09
Insulating material group IIIa
Comparative tracking index (IEC 60112) CTI 325
Rated insulation voltage (III/3) 63 V
Rated surge voltage (III/3) 2.5 kV
minimum clearance value - non-homogenous field (III/3) 1.5 mm
minimum creepage distance (III/3) 2 mm
Rated insulation voltage (III/2) 200 V
Rated surge voltage (III/2) 2.5 kV
minimum clearance value - non-homogenous field (III/2) 1.5 mm
minimum creepage distance (III/2) 2 mm
Rated insulation voltage (II/2) 200 V
Rated surge voltage (II/2) 2.5 kV
minimum clearance value - non-homogenous field (II/2) 1.5 mm
minimum creepage distance (II/2) 2 mm

Vibration test
Specification IEC 60068-2-6:1995-03
Frequency 10 - 150 - 10 Hz
Sweep speed 1 octave/min
Amplitude 0.35 mm (10 - 60.1 Hz)
Sweep speed 5g (60.1 - 150 Hz)
Test duration per axis 2.5 h
Glow-wire test
Specification IEC 60998-2-1:1990-04
Temperature 850 °C
Time of exposure 5 s
Ambient conditions
Ambient temperature (operation) -40 °C ... 100 °C (Depending on the current carrying capacity/derating curve)
Ambient temperature (storage/transport) -40 °C ... 70 °C
Relative humidity (storage/transport) 30 % ... 70 %
Ambient temperature (assembly) -5 °C ... 100 °C

Type of packaging 24 mm wide tape
[W] tape width 24 mm
[W2] coil overall dimension 30.4 mm
[A] coil diameter 330 mm
Outer packaging type Dry bag
ESD level (D) electrostatically conductive
Specification DIN EN 61340-5-1 (VDE 0300-5-1): 2008-07

Item number 1991817
Packing unit 350 pc
Minimum order quantity 350 pc
Note Made to Order (non-returnable)
Sales Key AAABCA
Product Key AALGAA
GTIN 4017918965853
Weight per Piece (including packing) 3.22 g
Weight per Piece (excluding packing) 2.947 g
Customs tariff number 85369010
Country of origin DE


ECLASS

ECLASS-9.0 27440401
ECLASS-10.0.1 27440401
ECLASS-11.0 27460101

ETIM

ETIM 8.0 EC002643

UNSPSC

UNSPSC 21.0

EAC

cULus Recognized

Approval Specification Data
Nominal Voltage UN Nominal Current IN Cross Section AWG Cross Section mm2
Use group B
300 V 10 A 30 - 16
Only flexible conductors 300 V 13.5 A 30 - 16
Use group D
300 V 10 A 30 - 16
Only flexible conductors 150 V 13.5 A 30 - 16

China RoHS Environmentally friendly use period: unlimited = EFUP-e
No hazardous substances above threshold values

Your advantages

Well-known connection principle allows worldwide use
Low temperature rise, thanks to maximum contact force
Allows connection of two conductors
Extremely small design for the respective conductor cross section
Designed for integration into the SMT soldering process