SMD female connector - FP 1,27/ 50-FH 1714878

SMD female connector, Nominal current at 20 °C: 1.4 A, Test voltage: 500 V AC, number of positions: 50, pitch: 1.27 mm, color: black, contact surface: Gold, type of contact: Female connector, mounting: SMD soldering

Product Details

Processing notes
Classification temperature Tc 260 °C
Moisture Sensitive Level MSL 1
Process Reflow soldering

Thermal test | Test group C
Tested number of positions 50
Specification IEC 60512-5-2:2002-02
Electrical properties
Pollution degree 2
Contact resistance 25 mΩ
Air clearances and creepage distances |
Rated insulation voltage (II/2) 10 V
Minimum value for clearance and creepage distance 0.4 mm
minimum clearance value - non-homogenous field (II/2) 0.4 mm
Insulating material group IIIa
Comparative tracking index (IEC 60112:2003-01) CTI 175
minimum creepage distance (II/2) 0.4 mm
Rated surge voltage (II/2) 0.8 kV
Rated insulation voltage (III/3) 500 V

Rated voltage (II/2) 10 V
Nominal current IN 1.4 A
1.4 A IEC 60512-5-2:2002-02 (50-pos.)
Rated surge voltage (II/2) 0.8 kV
Test voltage 500 V AC IEC 60512-4-1:2003
Nominal voltage UN 500 V (AC)

[W2] coil overall dimension 62.4 mm
[W] tape width 56 mm
Outer packaging type Transparent-Bag
[A] coil diameter 330 mm
Specification DIN EN 61340-5-1 (VDE 0300-5-1): 2008-07
Type of packaging 56 mm wide tape
ESD level (D) electrostatically conductive

Durability test
Contact resistance R2 25 mΩ
Contact resistance R1 25 mΩ
Impulse withstand voltage at sea level 0.8 kV
Specification IEC 60512-9-1:2010-03 (following)
Insulation resistance, neighboring positions ≥ 10 GΩ
Insertion/withdrawal cycles 500
Climatic test
Corrosive stress Method 1, 10 days
Power-frequency withstand voltage 500 V AC
Specification IEC 60512-11-7:2003-05
Ambient conditions
Ambient temperature (operation) -55 °C ... 125 °C
Ambient temperature (assembly) -5 °C ... 100 °C
Ambient temperature (storage/transport) -40 °C ... 70 °C
Vibration test
Amplitude 1.5 mm (10 - 60.1 Hz)
Test duration per axis 2.5 h
Frequency 10 - 2000 - 10 Hz
Specification IEC 60068-2-6:2007-12
Sweep speed 1 octave/min
20g (60.1 - 2000 Hz)
Test directions X-, Y- and Z-axis (pos. and neg.)
Specification IEC 60068-2-27:2008-02
Acceleration 50g
Shock duration 11 ms
Pulse shape Semi-sinusoidal

Dimensional drawing
Installed height 3.8 mm
Length 7.2 mm
Coplanarity ≤ 0.1 mm
Pitch 1.27 mm
Height 4.55 mm
Width 36.84 mm
PCB design
Pin spacing 1.27 mm
Pad geometry 0.8 x 0.8 mm
Contact cover 0.9 mm
Medium offset ± 0.7 mm in longitudinal and transverse direction
Overlap length 1.5 mm
Angular tolerance ± 4 ° in longitudinal direction
± 2 ° in transverse direction

Insertion and withdrawal forces
No. of cycles 500
Withdraw strength per pos. approx. 0.5 N
Insertion strength per pos. approx. 0.5 N
Result Test passed
Visual inspection
Specification IEC 60512-1-1:2002-02
Result Test passed
Resistance of inscriptions
Specification IEC 60068-2-70:1995-12
Result Test passed
Dimension check
Specification IEC 60512-1-2:2002-02
Result Test passed

Material data - housing
Insulating material group IIIa
CTI according to IEC 60112 175
Housing color black (9005)
Insulating material LCP
Flammability rating according to UL 94 V0
Material data - contact
Contact material Cu alloy
Surface characteristics Selective coating
Note WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Metal surface contact area (top layer) Gold (Au)
Metal surface contact area (middle layer) Nickel (Ni) Palladium nickel, (PdNi)
Metal surface soldering area (top layer) Tin (Sn)

Number of positions 50
Number of potentials 50
Number of levels 2
Connector system FINEPITCH 1,27 mm
Pin layout Linear pad geometry

Order Key 1714878
Packing unit 560 pc
Minimum order quantity 560 pc
Sales Key AAD
GTIN 4055626400785
Weight per Piece (including packing) 2.8 GRM
Weight per Piece (excluding packing) 2.8 GRM
Customs tariff number 85366930
Country of origin CZ

cULus Recognized

China RoHS Environmentally friendly use period: unlimited = EFUP-e
No hazardous substances above threshold values

Your advantages

Gold-plated contacts ensure transfer quality remains stable over the long term
Compact, high-position board-to-board or wire-to-board connectors for space-saving device designs
Stacked, coplanar or orthogonal PCB connections enable maximum flexibility in the device
Male and female connectors of different height can be combined – for individual PCB spacing of 8 mm ... 13.8 mm