PCB headers - MDSTB 2,5/ 4-G1-5,08 BUGY NZ 1714948

PCB headers, nominal cross section: 2.5 mm2, color: blue grey, nominal current: 10 A, rated voltage (III/2): 320 V, contact surface: Tin, type of contact: Male connector, Number of potentials: 8, Number of rows: 2, Number of positions per row: 4, number of connections: 8, product range: MDSTB 2,5/..-G1, pitch: 5.08 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.5 mm, Stecksystem: CLASSIC COMBICON, Locking: without, type of packaging: packed in cardboard

Product Details




Mounting type

Electrical properties
Rated voltage (III/2) 320 V
Rated surge voltage (III/2) 4 kV
Pollution degree 2
Air clearances and creepage distances |
Specification IEC 60664-1:2007-04
Insulating material group I
Comparative tracking index (IEC 60112:2003-01) CTI 600
minimum clearance value - non-homogenous field (III/3) 3 mm
minimum creepage distance (III/3) 3.2 mm
minimum clearance value - non-homogenous field (III/2) 3 mm
minimum creepage distance (III/2) 3 mm
minimum clearance value - non-homogenous field (II/2) 3 mm
minimum creepage distance (II/2) 3.2 mm

Nominal voltage UN 250 V
Nominal current IN 10 A
Contact resistance 2.1 mΩ
Insulation resistance > 0.2 TΩ, (IEC 60512-3-1:2002-02)
Insulation resistance > 48 GΩ, (IEC 60512-3-1:2002-02)
Insulation resistance > 48 GΩ, (IEC 60512-3-1:2002-02)
Insulation resistance > 16 GΩ, (IEC 60512-3-1:2002-02)
Insulation resistance > 16 GΩ, (IEC 60512-3-1:2002-02)
Contact resistance
Insulation resistance > 10 GΩ, (IEC 60512-3-1:2002-02)
Contact resistance 1.8 mΩ
Insulation resistance > 0.1 TΩ, (IEC 60512-3-1:2002-02)
Contact resistance 3.1 mΩ
Insulation resistance > 24 GΩ, (IEC 60512-3-1:2002-02)
Contact resistance 2 mΩ
Insulation resistance > 50 GΩ, (IEC 60512-3-1:2002-02)
Contact resistance 2.1 mΩ
Insulation resistance > 50 GΩ, (IEC 60512-3-1:2002-02)
Contact resistance 1.8 mΩ
Insulation resistance > 20 GΩ, (IEC 60512-3-1:2002-02)
Nominal current IN 10 A

Type of packaging packed in cardboard

Dimensional drawing
Width 21.88 mm
Height 32.5 mm
Installed height 29 mm
Length of the solder pin 3.5 mm
Length 22 mm
Length of the solder pin 3.5 mm
Pin dimensions 1 x 1 mm
Hole diameter 1.4 mm
Pitch 5.08 mm

Ambient temperature (operation) -40 °C ... 100 °C (dependent on the derating curve)
Ambient temperature (storage/transport) -40 °C ... 70 °C
Ambient temperature (assembly) -5 °C ... 100 °C

Environmental Product Compliance
China RoHS Environmentally friendly use period: unlimited = EFUP-e
China RoHS No hazardous substances above threshold values

Material data - housing
Housing color blue grey (7031)
Insulating material PA
Insulating material group I
CTI according to IEC 60112 600
Flammability rating according to UL 94 V0
Glow wire flammability index GWFI according to EN 60695-2-12 850
Glow wire ignition temperature GWIT according to EN 60695-2-13 775
Temperature for the ball pressure test according to EN 60695-10-2 125 °C
Material data - contact
Note WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact material Cu alloy
Surface characteristics Tin-plated
Metal surface contact area (top layer) Tin (5 - 7 µm Sn)
Metal surface contact area (middle layer) Nickel (2 - 3 µm Ni),
Metal surface soldering area (top layer) Tin (5 - 7 µm Sn)
Metal surface soldering area (middle layer) Nickel (2 - 3 µm Ni)

Number of positions 4
Number of connections 8
Number of levels 2
Plug-in system CLASSIC COMBICON
Mounting flange without
Number of potentials 8
Pin layout Linear pinning


Order Key 1714948
Packing unit 50 pc
Minimum order quantity 1 pc
Note Made to Order (non-returnable)
GTIN 4046356103138
Weight per Piece (including packing) 8.4 GRM
Weight per Piece (excluding packing) 6.9 GRM
Customs tariff number 85366930
Country of origin GR



Your advantages

Maximum flexibility when it comes to device design – one header for connectors with different connection technologies
Easy PCB replacement thanks to plug-in modules
Well-known mounting principle allows worldwide use
Conductor connection on several levels enables higher contact density