Passive heatsinks and thermal simulations for ICS electronics housings Some things are even better when cooled.
Passive heatsinks for ICS series electronics housings enable the finished devices to be used even in thermally demanding applications. By performing extensive thermal simulations, Phoenix Contact also supports you in optimizing your printed circuit board layout.
- Passive heatsinks enable the finished devices to be used in thermally demanding applications
- Extensive thermal simulations help achieve the optimum arrangement of components on the printed circuit board
- Customized heatsinks ensure reliable heat dissipation
- Simplified engineering process: all the services needed for your specific device design