New fillers for modular ICS housings
For the modular electronics housings in the ICS series from Phoenix Contact, fillers in depths of 67.5, 90, and 112.5 mm are now also available.
They are available with or without vents in gray, black, blue, and yellow. The new fillers extend the variety of connection technology that can be used. They can be individually processed for a customer-specific connection technology. The deeper fillers enable time- and cost-optimized mounting.
The new fillers can be used in the ICS 20, 25, and 50 housings. The ICS housing system can be used flexibly due to the modular system and the modularity of the connection technology. Stable guide rails enable quick and easy push-in mounting of assembled printed circuit boards. The design, colors, and printing of the housings can also be customized via an online configurator.