PC 4/ 2-G-6,35 P26 THR R44
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PCB header
1301943
PCB headers, nominal cross section: 4 mm2, color: black, nominal current: 24 A, rated voltage (III/2): 800 V, contact surface: Sn, contact connection type: Pin, number of rows: 1, number of positions: 2, product range: PC 4/..-G-THR, pitch: 6.35 mm, mounting: THR soldering / wave soldering, pin layout: Zigzag pinning M, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON PC 4, Pin connector pattern alignment: Standard, locking: without, mounting method: without, type of packaging: 44 mm wide tape
Product details
| Product type | PCB headers |
| Product family | PC 4/..-G-THR |
| Product line | COMBICON Connectors L |
| Number of positions | 2 |
| Pitch | 6.35 mm |
| Number of rows | 1 |
| Pin layout | Zigzag pinning M |
| Solder pins per potential | 1 |
| Properties | |
| Nominal current IN | 24 A |
| Nominal voltage UN | 800 V |
| Contact resistance | 0.81 mΩ |
| Rated voltage (III/3) | 630 V |
| Rated surge voltage (III/3) | 6 kV |
| Rated voltage (III/2) | 800 V |
| Rated surge voltage (III/2) | 6 kV |
| Rated voltage (II/2) | 1000 V |
| Rated surge voltage (II/2) | 6 kV |
| Mounting type | THR soldering / wave soldering |
| Pin layout | Zigzag pinning M |
| Processing notes | |
| Process | Reflow/wave soldering |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
| Solder cycles in the reflow | 3 |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Tin-plated |
| Metal surface contact area (top layer) | Tin (3 - 5 µm Sn) |
| Metal surface contact area (middle layer) | Nickel (1.3 - 3 µm Ni) |
| Metal surface soldering area (top layer) | Tin (3 - 5 µm Sn) |
| Metal surface soldering area (middle layer) | Nickel (1.3 - 3 µm Ni) |
| Material data - housing | |
| Color (Housing) | black (9005) |
| Insulating material | LCP |
| Insulating material group | IIIa |
| CTI according to IEC 60112 | 175 |
| Flammability rating according to UL 94 | V0 |
| Glow wire flammability index GWFI according to EN 60695-2-12 | 850 |
| Glow wire ignition temperature GWIT according to EN 60695-2-13 | 775 |
| Temperature for the ball pressure test according to EN 60695-10-2 | 200 °C |
| Notes on operation | In accordance with IEC 61984, COMBICON connectors have no switching power (COC). During designated use, they must not be plugged in or disconnected when carrying voltage or under load. |
| Dimensional drawing |
|
| Pitch | 6.35 mm |
| Width [w] | 15.65 mm |
| Height [h] | 12.8 mm |
| Length [l] | 25 mm |
| Installed height | 10.2 mm |
| Solder pin length [P] | 2.6 mm |
| Pin dimensions | 1.2 x 1 mm |
| PCB design | |
| Hole diameter | 1.7 mm |
| Visual inspection | |
| Specification | IEC 60512-1-1:2002-02 |
| Result | Test passed |
| Dimension check | |
| Specification | IEC 60512-1-2:2002-02 |
| Result | Test passed |
| Resistance of inscriptions | |
| Specification | IEC 60068-2-70:1995-12 |
| Result | Test passed |
| Polarization and coding | |
| Specification | IEC 60512-13-5:2006-02 |
| Result | Test passed |
| Contact holder in insert | |
| Specification | IEC 60512-15-1:2008-05 |
| Contact holder in insert Requirements >20 N |
Test passed |
| Insertion and withdrawal forces | |
| Result | Test passed |
| No. of cycles | 25 |
| Insertion strength per pos. approx. | 5 N |
| Withdraw strength per pos. approx. | 4 N |
| Thermal test | Test group C | |
| Specification | IEC 60512-5-1:2002-02 |
| Tested number of positions | 12 |
| Insulation resistance | |
| Specification | IEC 60512-3-1:2002-02 |
| Insulation resistance, neighboring positions | > 5 MΩ |
| Air clearances and creepage distances | | |
| Specification | IEC 60664-1:2020-05 |
| Insulating material group | IIIa |
| Comparative tracking index (IEC 60112) | CTI 175 |
| Rated insulation voltage (III/3) | 630 V |
| Rated surge voltage (III/3) | 6 kV |
| minimum clearance value - non-homogenous field (III/3) | 5.5 mm |
| minimum creepage distance (III/3) | 10 mm |
| Rated insulation voltage (III/2) | 800 V |
| Rated surge voltage (III/2) | 6 kV |
| minimum clearance value - non-homogenous field (III/2) | 5.5 mm |
| minimum creepage distance (III/2) | 8 mm |
| Rated insulation voltage (II/2) | 1000 V |
| Rated surge voltage (II/2) | 6 kV |
| minimum clearance value - non-homogenous field (II/2) | 5.5 mm |
| minimum creepage distance (II/2) | 10 mm |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 150 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.35 mm (10 Hz ... 60.1 Hz) |
| Acceleration | 50 m/s² (60.1 Hz ... 150 Hz) |
| Test duration per axis | 2.5 h |
| Test directions | X-, Y- and Z-axis |
| Durability test | |
| Specification | IEC 60512-9-1:2010-03 |
| Impulse withstand voltage at sea level | 9.8 kV |
| Contact resistance R1 | 0.81 mΩ |
| Contact resistance R2 | 0.95 mΩ |
| Insertion/withdrawal cycles | 25 |
| Insulation resistance, neighboring positions | > 5 MΩ |
| Climatic test | |
| Specification | EN ISO 22479:2022-06 |
| Corrosive stress | 0.2 dm3 SO2 on 300 dm3/40 °C/1 cycle |
| Thermal stress | 105 °C/168 h |
| Power-frequency withstand voltage | 4.26 kV |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C ... 105 °C (dependent on the derating curve) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Dimensional drawing |
|
| Type of packaging | 44 mm wide tape |
| [W] tape width | 44 mm |
| [W2] coil overall dimension | ≤ 50.4 mm |
| [A] coil diameter | ≤ 330 mm |
| Outer packaging type | Transparent-Bag |
| ESD level | (D) electrostatically conductive |
| Specification | DIN EN 61340-5-1 (VDE 0300-5-1): 2008-07 |
Compatible products
Your advantages
Designed for integration into the SMT soldering process
Increased touch protection in the pin connector pattern for maximum safety even when not plugged in
Easy PCB replacement thanks to plug-in modules
Frequently asked questions
Is the header reflow-capable?
The header and the coding profile are reflow-capable.
How do I need to connect the shroud to the ground potential?
The shroud is connected to the ground potential via the connector and the header. The header contact on the position of the center flange must be connected to the ground potential. There is no need for further provisions.
Why does the header require zigzag pinning?
The connector and header are designed for voltages up to 1000 V. Zigzag pinning is required in order to implement the necessary air clearances and creepage distances.