CUC-SP-J1ST-S/R4LT-SMD
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RJ45 PCB connector
1149611
RJ45 PCB connector, design: RJ45, degree of protection: IP20, number of positions: 8, 10 Gbps, material: Metal, connection method: SMD reflow
Product details
| Product type | Data connector (device side) |
| Type | RJ45 |
| Number of positions | 8 |
| Connection profile | RJ45 |
| Type of packaging | Tape and Reel |
| [W] tape width | 44.00 mm |
| [A] coil diameter | 330.00 mm |
| [W2] coil overall dimension | 49.00 mm |
| Housing shield springs | No |
| Number of slots | 1 |
| Type | Socket |
| Shielded | yes |
| Insulation characteristics | |
| Overvoltage category | I |
| Degree of pollution | 2 |
| Rated voltage (III/2) | 72 V DC |
| Rated surge voltage | 1.5 kV DC |
| Rated surge voltage (III/3) | 1.5 kV |
| Rated surge voltage | 1 kV DC |
| Rated current | 1.5 A |
| Frequency range | 10 Hz ... 500 Hz |
| Insulation resistance | > 500 MΩ |
| Test voltage | 1 kV DC |
| Test voltage Core/Core | 1 kV DC |
| Test voltage Core/Shield | 1.50 kV DC |
| Transmission medium | Copper |
| Transmission speed | 10 Gbps |
| Power transmission | PoE++ |
| Connection technology | |
| Connection method | SMD reflow |
| Width | 16.1 mm |
| Height | 14.5 mm |
| Length | 13.5 mm |
| Installed height | 13.20 mm |
| Orientation to PCB | 180.00 ° |
| Material Metal surface contact area (middle layer) | Ni (1.27 µm/50 µ") |
| Material | Copper alloy |
| Flammability rating according to UL 94 | V0 |
| Housing material | Metal |
| Housing surface material | Ni |
| Contact material | Phosphor bronze |
| Contact surface material | Gold |
| Contact carrier material | PA 9T GF |
| Test voltage Core/Core | 1 kV DC |
| Test voltage Core/Shield | 1.50 kV DC |
| Halogen-free | no |
| Flame resistance | UL 94 V0 |
| Mechanical data | |
| Insertion/withdrawal cycles | > 750 |
| Insertion force per signal contact | < 20.00 N |
| Extraction force per signal contact | < 20 N |
| Test specification | |
| Frequency | 10-500 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.35 mm |
| Acceleration | 50.00 m/s² |
| Test duration | 20.00 s |
| Test specification | |
| Specification | IEC60068-2-27 |
| Acceleration | 295.00 m/s² |
| Ambient conditions | |
| Degree of protection | IP20 |
| Ambient temperature (operation) | -40 °C ... 85 °C |
| Ambient temperature (storage/transport) | -40 °C ... 85 °C |
| Flame resistance | UL 94 V0 |
| Mounting type | SMD soldering |
| Processing notes | |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
| Solder cycles in the reflow | 3 |
| Item number | 1149611 |
| Packing unit | 180 pc |
| Minimum order quantity | 180 pc |
| Sales key | ABNADB |
| Product key | ABNADB |
| GTIN | 4063151143848 |
| Weight per piece (including packing) | 6.26 g |
| Weight per piece (excluding packing) | 4.63 g |
| Customs tariff number | 85366900 |
| Country of origin | TW |
ECLASS
| ECLASS-13.0 | 27460201 |
ETIM
| ETIM 9.0 | EC002637 |
UNSPSC
| UNSPSC 21.0 | 39121400 |
| EU RoHS | |
| Fulfills EU RoHS substance requirements | Yes (No exemptions) |
| China RoHS | |
| Environment friendly use period (EFUP) |
EFUP-E
No hazardous substances above the limits
|
| EU REACH SVHC | |
| REACH candidate substance (CAS No.) | No substance above 0.1 wt% |
Your advantages
The reflow capability enables efficient, cost-optimized processing
The extended temperature range from -40 °C to +85 °C enables use in demanding applications
PHOENIX CONTACT AG
Zürcherstrasse 22, CH-8317 Tagelswangen