ICS25-B100X98-V-7035 - Mounting base housing
2203881

DIN rail housing, Lower housing part with metal foot catch, Level 1: with vents, width: 25 mm, height: 100 mm, depth: 108.35 mm, color: light grey (similar RAL 7035), cross connection: DIN rail connector (optional), number of positions cross connector: 8

This product needs further products for operation. Mandatory accessories

Product details








Compatible products




Your advantages

Flexible use, thanks to the modular system and unique modularity in the connection technology
Standardized connections such as RJ45, USB, D-SUB and antenna sockets as components that can be integrated
Optimal space utilization, as well as adaptability of design, colors, and printing
Eight-position DIN rail connectors with parallel and up to two serial contacts for easy module-to-module communication

Frequently asked questions


What support does Phoenix Contact provide in the area of thermal management?

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Phoenix Contact supports you with catalog values, online simulations, personal consultation including simulation services, and (individually adapted) heatsinks.... View more

Phoenix Contact supports you with catalog values, online simulations, personal consultation including simulation services, and (individually adapted) heatsinks.

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For which housing families are heatsinks available?

Heatsinks are currently available for the ICS (Industrial Case System) and the UCS (Universal Case System).... View more

Heatsinks are currently available for the ICS (Industrial Case System) and the UCS (Universal Case System).

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How is heat transferred between the hotspot and the heatsink?

The component that heats strongly (the hotspot) is connected to the heatsink by a thermally conductive material (TIM). In the case of the UCS housing system, optionally inserted heat spreaders can also bridge larger distances between the component to... View more

The component that heats strongly (the hotspot) is connected to the heatsink by a thermally conductive material (TIM). In the case of the UCS housing system, optionally inserted heat spreaders can also bridge larger distances between the component to be cooled and the heatsink.

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How are components of different heights and sizes ideally connected to the heatsink?

The optimum thermal connection is implemented by individual adjustments of the heatsink. This is usually done by a milling operation on the heatsink.... View more

The optimum thermal connection is implemented by individual adjustments of the heatsink. This is usually done by a milling operation on the heatsink.

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What influence does heating have on the reliability of a device?

The maximum temperature has the greatest impact on the reliability and service life of your device. With a temperature increase of 10°C the failure rate is doubled.... View more

The maximum temperature has the greatest impact on the reliability and service life of your device. With a temperature increase of 10°C the failure rate is doubled.

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Which factors influence the temperature in the housing?

Small and powerful components, high data rates, dust, and insufficient ventilation of the housing are reasons for a high temperature difference compared to the environment.... View more

Small and powerful components, high data rates, dust, and insufficient ventilation of the housing are reasons for a high temperature difference compared to the environment.

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What information do the power dissipation diagrams provide?

The graphs of the diagrams provide information on which power the components may supply in the respective housing in order not to exceed a temperature difference to the environment. The slope of the straight line describes the thermal conductance of ... View more

The graphs of the diagrams provide information on which power the components may supply in the respective housing in order not to exceed a temperature difference to the environment. The slope of the straight line describes the thermal conductance of the system. The cases shown differ, on the one hand, in that one features full-surface heating while the other features heating of a hotspot of 20 x 20 mm and, on the other hand, in that one has a printed circuit board installed in the housing and one does not have a housing.

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How do heatsinks help dissipate developing heat?

video thumbnail of faq answer

The integrated heatsinks from Phoenix Contact dissipate heat from the hotspot by means of heat conduction via thermally conductive material (TIM). The heatsink releases this heat in the form of radiant energy and via convection between the slats to t... View more

The integrated heatsinks from Phoenix Contact dissipate heat from the hotspot by means of heat conduction via thermally conductive material (TIM). The heatsink releases this heat in the form of radiant energy and via convection between the slats to the environment. The stack effect is utilized, during which the heated air rises and is displaced by cold air.

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What other options are there for thermal optimization?

In many cases, rearranging the hotspots or installing vents is sufficient. A simulation of the thermal conditions provides information on which option is best suited.... View more

In many cases, rearranging the hotspots or installing vents is sufficient. A simulation of the thermal conditions provides information on which option is best suited.

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