SMD male connectors - FS 0,635/ 20-MV-R- 5,0
1332120

SMD male connector, nominal current: 0.5 A, Test voltage: 500 V AC, number of positions: 20, pitch: 0.635 mm, color: black, contact surface: Gold


Product Details




Product type SMD male connector
Number of positions 20
Pitch 0.635 mm
Number of rows 2
Pin layout Linear pad geometry

Nominal current IN 0.5 A IEC 60512-5-2:2002-02 (40-pos. / 60-pos.)
Pollution degree 3
Contact resistance 40 mΩ
Test voltage 500 V AC IEC 60512-4-1:2003
Rated voltage (I/1) 125 V
Rated surge voltage (I/1) 0.8 kV

Mounting type SMD soldering
Processing notes
Process Reflow soldering
Moisture Sensitive Level MSL 1
Classification temperature Tc 260 °C
Solder cycles in the reflow 3

Material data - contact
Note WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact material Cu alloy
Surface characteristics Selective coating
Metal surface contact area (top layer) Gold (Au)
Metal surface contact area (middle layer) Nickel (Ni)
Metal surface soldering area (top layer) Tin (Sn)
Metal surface soldering area (middle layer) Nickel (Ni)
Material data - housing
Housing color black (9005)
Insulating material LCP

Notes on operation The permissible voltage during operation depends on the application, taking into consideration the air clearances and creepage distances within the scope of insulation requirements in accordance with IEC 60664-1.

Dimensional drawing
Pitch 0.635 mm
Width [w] 13.22 mm
Height [h] 5.6 mm
Length [l] 5.2 mm
Installed height 5 mm
Application
Contact cover 0.6 mm
Center offset ± 0.5 mm in longitudinal and transverse direction
Stack height 6 mm Tolerance: +0.6 mm (in combination with Range of articles:FS 0,635-FV-R- 4,0)
12 mm Tolerance: +0.6 mm (in combination with Range of articles:FS 0,635-FV-R-10,0)
Wipe length 0.6 mm
Angular tolerance ± 10 ° in longitudinal and transverse direction (when plugging in)
± 2 ° in longitudinal and transverse direction (when plugged in)
PCB design
Pad geometry 0.35 x 1.8 mm

Thermal test | Test group C
Specification IEC 60512-5-2:2002-02
Tested number of positions 60
Insulation resistance
Specification IEC 60512-3-1:2002-02
Insulation resistance, neighboring positions ≥ 5 GΩ
Air clearances and creepage distances |
Specification IEC 60664-1:2007-04
Minimum value for clearance and creepage distance 0.19 mm

Vibration test
Specification IEC 60068-2-6:2007-12
Frequency 10 - 55 - 10 Hz
Sweep speed 1 octave/min
Amplitude 1.52 mm
Sweep speed 181 m/s²
Test duration per axis 2 h
Durability test
Specification IEC 60512-9-1:2010-03 (following)
Contact resistance R1 40 mΩ
Contact resistance R2 40 mΩ
Insertion/withdrawal cycles 50
Insulation resistance, neighboring positions ≥ 5 GΩ
Climatic test
Specification IEC 60068-2-60:2015-06
Corrosive stress Method 4, 10 days
Thermal stress 125 °C/168 h
Power-frequency withstand voltage 500 V
Ambient conditions
Ambient temperature (operation) -55 °C ... 125 °C
Ambient temperature (storage/transport) -40 °C ... 70 °C
Relative humidity (storage/transport) 30 % ... 70 %
Ambient temperature (assembly) -5 °C ... 100 °C

Dimensional drawing
Type of packaging 32 mm wide tape
[W] tape width 32 mm
[W2] coil overall dimension 38.4 mm
[A] coil diameter 330 mm
Outer packaging type Transparent-Bag
ESD level (D) electrostatically conductive
Specification DIN EN 61340-5-1 (VDE 0300-5-1): 2008-07

Item number 1332120
Packing unit 850 pc
Minimum order quantity 850 pc
Note Made to Order (non-returnable)
Sales Key #####
Product Key AAWGCA
GTIN 4063151629229
Weight per Piece (including packing) 0.91 g
Weight per Piece (excluding packing) 0.91 g
Customs tariff number 85366930
Country of origin CN


ECLASS

ECLASS-9.0 27440402
ECLASS-10.0.1 27440402
ECLASS-11.0 27460201

ETIM

ETIM 8.0 EC002637

UNSPSC

UNSPSC 21.0 39121400

China RoHS Environmentally friendly use period: unlimited = EFUP-e
No hazardous substances above threshold values

Your advantages

Design-in support during device development through M-CAD/E-CAD data and a free sample service
Cost and space savings with the comprehensive portfolio available in various stack heights
Easy mating with integrated keyways and tolerance compensation for error-free production
High-speed data transmission up to 20 Gbps for various possible applications
Time savings during the development process with customer-specific simulations for data integrity
Gold-plated contacts ensure transfer quality remains stable over the long term