Material tests for connectors and electronics housings High quality through material tests for optimum long-term behavior in test batch A
In order to assess their suitability and long-term behavior, the materials used by Phoenix Contact are subjected to further comprehensive tests in addition to computer-aided simulations. Do the material properties change under certain conditions? – This ensures that only materials that satisfy the highest demands for reliability and dependability are used.
Glow-wire test being performed on an electronics housing in a Phoenix Contact laboratory
Glow-wire test
The glow-wire test simulates thermal stresses that run, for example, through glowing parts or short-term overloaded electrical resistances. During the test, the tip of the glow-wire is in contact with the test object for 30 seconds at a contact pressure of 1 N. In cases where the material is melted away by the glow-wire, the penetration depth of the glow-wire in the material is limited to 7 mm. Flames or a red-hot glow on the test object must extinguish no longer than 30 seconds after removing the glow-wire.
Thermographic image of a PCB terminal block
Thermographic imaging
The electrical and thermal behavior of a material or product are visualized and quantitatively assessed using thermographic imaging. With correspondingly detailed images taken of the component in the application, heat management can be finely tuned. This way, optimizations are easy to identify from the corresponding heat sources and hot spots
Recording of a scanning electron microscopy procedure
Scanning electron microscopy
Scanning electron microscopy permits high resolution material and topography analyses, including the element determination and chemical composition of a sample to be analyzed. These results support the development process, especially when it comes to miniaturized components, and ensure material properties as part of the quality assurance process.
Computed tomography during a laboratory test
Computer tomography
Computer tomography enables a rapid and precise analysis, particularly with regard to increasingly complex modules. A non-destructive, three-dimensional functional analysis of components, for example in the closed housing, can serve as a quick solution to specific technological questions. A non-destructive incision through all elements of the component or device can be made that can be used to show the installation conditions of all individual components at each preferred area.
