Heat out. Power in. Optimized cooling for electronics housings

Phoenix Contact 3

ICS series modular electronics housings The optimized use of tailor-made heatsinks in the ICS series modular housings ensures effective heat dissipation for reliable operation in IoT applications. ME-IO series multifunctional electronics housings The ME-IO housing series combines high thermal efficiency with a modular design and front connection technology for use in modern control systems. UCS series universal housings The UCS series universal housings feature a flexible, modular design that enables optimum heat dissipation in embedded systems. BC series electronics housings The BC series DIN rail housings with precisely coordinated heatsinks are ideal for the demanding conditions in building automation. Phoenix Contact 5

Targeted thermal management The power density of electronic systems increases as their size decreases. This trend makes it a challenge to dissipate the lost heat into the environment in a targeted manner. To describe the thermal conduction in electronic components, the thermal resistance Rth in K/W is used. This value describes the maximum heat output P [W] that can be dissipated with a specified temperature difference ΔT [K], and serves as an indicator of the performance of a heatsink. Heat can be transferred through thermal conduction, convection, and heat radiation. When developing a cooling concept, analyzing the heat paths and higher-level transport mechanisms is particularly challenging. Through targeted optimization of the heat transport mechanisms, the dissipation performance is increased and, at the same time, the service life of the electronic components is extended. Phoenix Contact 7

The thermal optimization of electronic devices always depends on the application These tips can help: • Use of electronics housings with ventilation slots instead of closed housings • In general, hot spots (heat-critical components) should be placed near the lower ventilation slots to enable cool fresh air to circulate around them • At the same time, however, other thermally sensitive components must not be negatively impacted by the positioning of the hot spots • Use of a passive customer-specific heatsink Phoenix Contact 9

Use our intuitive online simulation tool to thermally analyze your application 1. Assemble your housing online to fit your application using our electronics housing configurator ℹ Web code: #0512 2. Position hot spots on the PCB and define the thermal boundary conditions of your application 3. Receive your application-specific results in the form of a 3D PDF by email 4. If needed, take advantage of our offer of an individual con- sultation or the customer-specific heatsink service from Phoenix Contact Phoenix Contact 11

Customized processing of the heatsink • Extruded aluminum heatsinks match the respective housing geometry for easy slide-in mounting • Custom milling of the standard heatsink depending on the customer application • Hot spots are connected to the heatsink via thermal interface materials (TIMs) • The heat-dissipating surface of the hot spot is enlarged by the heatsink • The heatsink spreads the heat loss of the component by thermal conduction and releases it into the environment by radiation and convection Phoenix Contact 13

Benefit from the services and product solutions from Phoenix Contact • Color versions, mechanical processing, and tool modifications for your customer-specific design • Customized membrane keypads for the ICS and BC housing series provide you with reliable input solutions for your smart devices • Touch displays offer great potential for implementing user-friendly and functional device displays • You can easily create your own customized housing solution using the online configuration tool Phoenix Contact 15