Surface mount technology (SMT) – a modern production process Modern module manufacturing is characterized by high functional and component density with growing demand for miniaturization and reduced surface requirements of the components on the PCB. At the same time, the focus is also on cost-optimized manufacturing. Over the last few years this has had a significant influence on the increasing integration of components and connectors that were previously conventionally assembled using wave soldering technology. Find out more with the web code For detailed information, use the web codes provided in this brochure. Simply enter # and the four-digit number in the search field on our website.  Web code: #1234 (example) Or use the direct link: phoenixcontact.com/webcode/#1234 2 Phoenix Contact

11 Surface mount technology – the basis for module manufacturing Surface mount technology is the basis for modern module manufacturing and is the result of decades of optimization in the module manufacturing process. Module manufacturing can be optimized and transformed into a cost-effective, high-quality, and less error-prone production process by switching from wired components that are mostly assembled by hand to surface-mounted components that support automated assembly. In contrast to the through-hole assembly of wired components, SMD components have solderable connection surfaces that are soldered directly onto the top side of the PCB. In this process, the contact surfaces of the PCB are printed with solder paste, a mixture of solder particles and flux. The solder contacts on the SMD components are set into the paste and then soldered in the reflow oven (Fig. 1). A driving factor in the development of SMD components is miniaturization and the associated increase in contact density and functionality on the PCB. The focus was therefore on the optimization of components with an electronic function (resistors, diodes, or ICs). With the increasing availability of components, interface components such as connectors also came under the spotlight. Connectors with low current loads and low requirements in terms of mechanical strain are already used in SMDs. There are currently two ways of integrating connectors with high requirements in terms of current carrying capacity and mechanical functions: 4 Phoenix Contact 1. 2. 3. 4. PCB with surface contacts Position template Apply solder paste Solder paste on contact pads 5. 6. 7. 8. Assemble component Component with contact to all solder paste surfaces Reflow soldering Done! Fig. 1: Sequence for the surface mount process 1. The connectors are treated as standard components and wave soldered in a second process step. 2. The connectors are integrated into the SMD process using THR technology.

3 SMD and THR connectors for the reflow process The use of components for different soldering technologies often necessitates the provision of several systems (wave/reflow soldering system) and the PCB being assembled in stages. The concurrent use of SMD and THR PCB connection technology is aimed at reducing the number of production steps and manufacturing the module using just one soldering process. Adjustments to existing production equipment or to the process control system are to be avoided wherever possible here. Regardless of which mounting type is used – SMD or THR – the components must be developed for the individual process steps of SMT mounting and the respective requirements. Alongside the requirements on the components themselves, the components and the processing of these must be integrated into the process chain accordingly. The fundamental steps in the chain are: application of the solder paste via printing (Fig. 3), component assembly (Fig. 4), reflow soldering (Fig. 5), and finally inspection with a qualitative assessment of the soldering spots (Fig. 6). The aim of this integration is to be Fig. 3: Printing Fig. 4: Assembly able to concurrently process wired through-hole THR components and surface-mountable SMT components – using the same equipment, in the same process, and under the same conditions. Only then is a reduction in the number of process steps (e.g., no additional wave soldering) and more cost-effective module manufacturing achieved. 6 Phoenix Contact Fig. 5: Reflow soldering Fig. 6: Inspection

. 5 0 8 4.05 0.55 . 4 4 2 . 0 6 6 2 Fig. 10: Example of documentation for the possible clearance below a THR connector M 2,5 6 6 , 4 3 , 6 5 , 1,4 2,3 Fig. 11: Example of layout recommendations for an SMD connector Fig. 12: Color versions Fig. 13: SMD connectors in white for light connections are also UV-resistant Clearances on the bottom of the component The contact of solder paste on plastic parts and the undefined melting-on can lead to residual solder balls or solder bridges which, at worst, cause short circuits in the module. Where possible, the components should have large clearances (Fig. 10) around the solder pin or the surface contact and be equipped with spacers known as standoffs. Furthermore, it must also be ensured through the layout of contact pads (Fig. 11) or residual rings that there is no contact between the insulating body of the component and the solder paste. Colored SMD/THR components Components for the reflow soldering process should ideally be black – this ensures very clear demarcation between the contacts and the housing and facilitates image capture via camera systems for the assembly process. Colored components (Fig. 12) can only be made available if the thermal stability of their color pigments is sufficient and, for certain applications, if the pigments are UV stable (Fig. 13). The color palette that is currently available is limited and dependent on the base material (polyamide or polymer). Thanks to improved exposure and contrast imaging, modern camera systems are capable of capturing the necessary details despite the poor contrast of the metals against the colored housings. 8 Phoenix Contact

Pad design/residual ring With regard to dimensioning the residual ring, the same requirements as those for wave-soldered pads largely apply. Taking into consideration the air clearances and creepage distances and the clearance below the component around the pin, the ring width should be between 0.2 and 0.5 mm. The potentially larger volume of paste on wider rings can have a positive effect on the soldering quality (meniscus formation). Hole diameter The use of THR technology requires modifications to the PCB layout. Selecting the correct hole diameter is important here. On the one hand, selecting a suitable hole diameter is important for ensuring the reflow of the solder in the reflow process; on the other hand, the hole size affects the ability to use automated assembly. Through the use of a suitable hole size, production tolerances are compensated and reliable assembly is possible. In practice, the longer the component the greater the production tolerances. To increase the assembly reliability of large, high-position components, it may be necessary to increase the internal diameter even further by up to 0.1 mm. For Phoenix Contact THR components, the recommended hole diameters for the individual series are documented based on the number of positions (e.g., see table for M12 THR connectors (Fig. 18)). Position tolerance – swash circumference The position tolerance of pins in through-hole pin strips indicates the permissible positional deviation of the pin tip from the zero position in the x or y direction. More illustrative is the swash circumference concept, which describes a circle with corresponding diameter for the deviation of the pin tip around the zero position. For example, in this case, a position tolerance of ±0.2 mm describes a circle with a diameter of 0.4 mm, the 10 Phoenix Contact THR product family (straight) Recommended layout * Number of positions 4 4 4 4/5 4/5 5 8 8 8 12 17 Coding A, D T S (cross) L, K L, K (FE/PE) A, B A X Y A A Design [male / female] Male / female Male / female Male / female Male / female Male / female Male / female Male / female Female Female Male / female Male / female Pin Ø [mm] Hole 1 1.3 1.3 1.3 1.15 1 0.8 0.8 0.8 / 0.8 0.6 0.6 1.3 1.6 1.6 1.6 1.45 1.3 1.1 1.1 1.1 1 1 Residual ring 2 2.6 2.6 2.6 2.6 2 2.1 1.75 1.8 1.7 1.45 Template 1.9 2.4 2.4 2.4 2.4 1.9 1.9 1.65 1.7 1.6 1.35 THR/wave product family (angled) Recommended layout * Number of positions 4 5 8 8 8 12 17 Coding A, D A, B A X Y A A Design [male / female] Male / female Male / female Male / female Female Female Male / female Male / female Pin Ø [mm] Hole 1 1 0.8 0.8 0.8 0.8 0.8 1.3 1.3 1.1 1.1 1.1 1.1 1.1 Residual ring 1.9 2 1.9 1.75 1.8 1.5 1.5 Template 1.8 1.9 1.8 1.65 1.7 1.4 1.4 SMD product family Recommended layout * Pin Ø [mm] Residual ring Template Number of positions Coding 4 4 5 8 8 8 12 17 A, D T A, B A X Y A A Design [male / female] Male / female Male / female Male / female Male / female Female Female Male / female Male / female 0.9 1.3 0.9 0.9 0.7 1.9 2.3 1.9 1.9 1.7 0.7 / 0.9 1.7 / 1.9 0.7 0.7 1.7 1.45 Fig. 18: M12 PCB design * For a PCB thickness of 1.6 mm 1.7 2.1 1.7 1.7 1.5 1.5 / 1.7 1.5 1.35 0.4 center of which is the ideal zero position of the pin tip. The current THR standard, DIN EN 61760-3, specifies ±0.2 mm as the maximum permissible position tolerance. This corresponds to a swash circumference with diameter 0.4 mm. The position tolerance of the pin tip in the hole is indicated by the swash circumference (Fig. 19). All Phoenix Contact THR components satisfy the requirements of the standard. Furthermore, a corresponding product portfolio is available for applications that require a position tolerance of ±0.1 mm. H ole in P C B 0.2 d ia g P in o n al 0.2 0.2 Fig. 19: Position tolerance of the pin tip in the hole – in accordance with the requirements of the standard, the tolerance of possible swash circumferences is 0.4 mm

Mounting bosses Mounting bosses are plastic pins that are integrated into the housing of the component, positioned in holes without surface coating. They prevent the component twisting in the event of floating during the soldering process and therefore prevent an impermissible lateral offset to the layout. Whether mounting bosses are necessary or not depends on the weight of the component. As a general rule, the same position tolerances also apply to the mounting boss holes (Fig. 22). Armatures SMD armatures for connectors primarily have two functions. First, to increase the secure positioning on the PCB and the mechanical stability when the connector is being plugged in and unplugged. Second, the additional armature surface can generate the necessary additional adhesion for overhead soldering during assembly on both sides (Fig. 23). Fig. 22: Connectors with positioning pins (mounting bosses) Fig. 23: PCB terminal block with lateral SMD armature 4.4 Specific requirements for combination SMD/THR components SMD contacts and THR armature metals Connectors solely intended for SMDs are used in device connection technology primarily within the device as board-to-board connections or wire-to-board connections, and less as direct external device connections. Double function for THR armature pins In addition to the necessary mechanical stability, the THR armatures additionally perform the function of the mounting bosses and secure the connector against movement during the soldering process. In the area of the SMD contacts, the space on the secondary side of the PCB can be used for the layout. For external device connections and for end user operation, the same high mechanical load values are required as for those of wave-soldered or THR-soldered through-hole connections. These are difficult to achieve with a pure SMD connector with similar connector dimensions. The use of connectors with SMD contacts and THR armature metals is ideal in this case (Fig. 24). This type of connector must also satisfy the aforementioned requirements for SMD and THR connectors. At the same time, this combination provides clear advantages. Fig. 24: Combination connector with SMD contacts and THR armature 12 Phoenix Contact

5.2 Moisture sensitivity level for reflow components Along with the classification temperature, the moisture sensitivity level (MSL) is the parameter which precisely describes the treatment of the component during the reflow process. Levels 1 to 6 are assigned depending on the capacity of the component to absorb moisture (Fig. 26). ∞ d e t i m i l n U e f i l r o o F l 1 Y r a e y 1 4 W 168 72 48 24 TOL l e b a l n o e m T i s k e e w 4 h 8 6 1 h 2 7 h 8 4 h 4 2 1 2 2a 3 4 5 5a 6 Level Fig. 26: MSLs and their associated floor life 5.3 Maximum permissible floor life = safe processing without damage in the reflow process Exposed processing means the removal of the previously defined dry component from its air-tight packaging and the processing of this component within the time specified by the level. During this time, the component can absorb moisture without suffering damage in the reflow process. Components that cannot absorb moisture or only small amounts are therefore candidates for level 1 (unlimited) without additional dry packaging (dry bag). These can be stored in the open and have an unlimited floor life for the process. Components that absorb moisture are classified with floor lives from 1 year (level 2) down to just a few hours (level 3 - 6). These components need dry bag packaging. The floor life begins when the bag is opened and ends on expiry of the time specified by the level. The risk of component damage increases Opening of the bag Moisture absorption during assembly Increase of risk of delamination and cracks 0 = Start Floor life Stop @ e.g., 168 h Fig. 27*: Floor life, example of the process for MSL 3 components significantly upon expiry of the floor time (Fig. 27). In order to be used again, the components must be dried (rebaked) and returned to their initial state. 14 Phoenix Contact * From JEDEC [IPC-JEDEC J-STD-033D, Figure 3-3] ©Copyright JEDEC Reproduced with permission from JEDEC

5.5 Qualification profile vs. operator profile Even though the qualification profile is close to real-world conditions, there may be deviations from the real profiles of the operator. Ultimately, the suitable soldering profile depends on many factors. The process engineer needs to find a compromise between board size and thickness, component types and density, solder paste and system equipment, and many other factors in order to solder the module cleanly. The qualification profiles and their classification temperatures therefore serve as a reference point for the process engineer as to whether the components can be soldered using the actual profile (Fig. 31/32). Temperature TP TL Liquidus Tsmax Tsmin Peak Ramp up Ramp down Preheating t tS Fig. 31*: Idealized qualification profile in accordance with the standard Time from 25°C to peak Time Preheating 1 Preheating 2 Preheating 3 Peak zone 1 Peak zone 2 Cooling zone Tsmin Tsmax Temperature [°C] TP = 260°C TL = 217°C TP = 25°C 00.0 120.0 240.0 Time [s] Fig. 32: Recorded actual operator profile 16 Phoenix Contact * From JEDEC [IPC/JEDEC J-STD-020E, Figure 5-1] ©Copyright JEDEC Reproduced with permission from JEDEC

6 Process integration – PCB layout, paste printing, assembly, soldering, and inspection Optimum process integration begins with the PCB layout. It is at this early stage that the foundations for the best possible soldering results are laid. The correct paste application has a significant impact on the end result, but there are also corresponding conditions for the error-free positioning of components during assembly. The soldering process and subsequent inspection are well described in standards. Each process step places requirements on the components which they in turn must satisfy through the optimum selection of materials and product design. 6.1 PCB layout SMD layout The pad size for a certain solder contact size and the overall layout (arrangement and spacing of the pads) are usually recommended in the manufacturer’s proposed layout. The proposed layout takes into consideration a sufficient area to produce soldering spots in accordance with the desired class of IPC A-610. The arrangement of the contacts in relation to each other is largely influenced by the required air clearances and creepage distances. Tolerances that must be observed for the component and during assembly which affect lateral overhang and contact overlap influence the pad spreads. Connection surfaces oversized for safety reasons should also be avoided, as well as connection pads that are potentially too small and tend to have too much lateral overhang. Ultimately, the layout is a compromise which may be optimized at any time based on individual experience (Fig. 37). THR layout – pad design/residual ring With regard to dimensioning the residual ring, the same requirements as those for wave-soldered pads largely apply. Taking into consideration the air clearances and creepage distances and the clearance below the component around the pin, the ring width should be between 0.2 and 0.5 mm. The potentially larger volume of paste on wider rings can have a positive effect on the soldering quality (meniscus formation). M 2,5 6 6 , 4 3 , 6 5 , 1,4 2,3 Fig. 37: Example of a recommended layout for an SMD connector 18 Phoenix Contact

THR paste volume – base parameters The volume of the paste printing must be twice as large as the volume that the solder takes after melting. Approximately half (by volume) of the solder paste consists of solder aids such as activators and fluxes, the rest is made up of solder in particle form with a standard particle size of between 25 and 45 µm. Paste types are classed according to the particle diameter, among other things. The necessary volume must be generated through the appropriate design of the layout, optimized printer parameters, and based on the behavior of the solder paste. Ideally, there is no overprinting on the upper residual ring (less soiling) and a slight through-print on the secondary side of the PCB at 100% hole-fill (Fig. 42). The template cutout (Fig. 43) is designed with a diameter that is approximately 0.1 mm smaller so that the template lays on the residual ring (Fig. 44). THR paste volume – additional areas In certain applications, especially those where the solder paste is more likely to drip, the through-printing is reduced (Fig. 45). The missing paste volumes must therefore be generated elsewhere. The simplest way of reducing the through-printing is by adjusting the 100 - 150 µm template thickness 100 - 150 µm template thickness Solder paste with low tendency to drip • No overprinting required (1) • Targeted through-printing of solder paste with a through-printing of up to 0.5 mm below the PCB (2) 1 0 - 0.5 mm 2 Fig. 42: Base pressure (ideal) ds dS = dA - 0.1 mm, where dA = di + 2 x R R R di dA (dS = Template cutout Ø) (dA = Soldering pad Ø) (Ei = Hole Ø) (R = Residual ring width) Fig. 43: Recommended template cutout This is intended to prevent the overprinting of solder paste on the solder resist. The necessary solder deposit results from the through-printed paste on the secondary side of the Solder paste Template Solder resist PCB Residual ring Fig. 44: Template positioned on the residual ring – no overprinting PCB. This method prevents soiling due to paste and reduces the risk of solder beading. squeegee blade angle, or alternatively by adding bars to the template (see “THR paste volume – reduced pressure”, page 21). residual ring. The melting paste flows out of these areas back to the residual ring and therefore increases the solder volume (Fig. 46). Less through-printing means a lower solder volume. To compensate for this, in certain spatial conditions, additional paste volumes can be made available through additional areas adjoining the Fig. 45: Reduced paste printing – less through-printing Fig. 46: Layout area for additional solder paste volume: layout and after printing 20 Phoenix Contact

Tape-on-reel packaging The most popular form of delivery for SMT assembly processes is tape-on-reel packaging (Fig. 52). Tape widths of between 16 mm and 104 mm are used for standard THR components. Due to the component size, tapes with very deep-drawn cavities are necessary – especially when dealing with tall components. A suitable feeder with a corresponding amount of free space must therefore be available. Furthermore, it must be ensured that the radius of the feeder is sufficient and that there is enough space for the tape to be fed into and out of the machine (Fig. 53). The space available at the feeder table of a machine is always tight (Fig. 54), especially if the feeder trolley is fixed and cannot be modified. This means that the use of the available space must always be optimized. Feeders in standard widths of between 16 mm and 56 mm are therefore preferred, 72 mm or 104 mm wide feeders are only installed in exceptional circumstances. This, however, also limits the component lengths/sizes in the tape. For larger components, both custom-made tapes and feeders are necessary. These are not unusual, but are uncommon and expensive. In such cases, it may be necessary to switch to the alternative – tray packaging. Fig. 52: Tape-on-reel packaging Fig. 53: Equipped feeder Fig. 54: Limited space available at the feeder table Tray packaging in a flat magazine The alternative use of flat magazines depends on several factors. In terms of components, the external dimensions primarily determine the limits within which the use of tapes is still expedient. Components with large volumes in terms of length or height also fit in a tape, but the availability of suitable feeders, a smaller number of packing units per tape, or dimensional limitations (deflection radius in the feeder) make their use in a tape system uneconomical. In this case, a flat magazine can be an economically attractive alternative (Fig. 55/56). Often, however, when it comes to the equipment, it is the availability of a tray feeder unit (tray tower, Fig. 57) alone that determines whether it is possible to benefit from this advantage. Where a tray tower is not integrated, retrofitting is not expedient in most cases, as it is cheaper to have larger tapes custom made and purchase a wider feeder. Choosing the appropriate form of packaging for a particular application is therefore very much dependent on the existing assembly system and the components involved. Fig. 55: M12 THR connectors in a tray Fig. 56: High-volume THR components in a tray Fig. 57: Tray feeder unit (tray tower) 22 Phoenix Contact

is performed at the lower limit of thermal loads. There is no one soldering profile that covers all components. The soldering profile is very individual and takes into consideration all of the process parameters – from the components, PCB, and solder paste to the equipment used (oven). It represents a compromise between all influencing factors with the aim of achieving optimum soldering results of a defined quality. The additional parameters and assignments in the aforementioned standard regarding the comparable component volume, the component thickness, and the maximum peak body temperatures enable a stress-reduced temperature load to protect components that cannot be subjected to such high loads (see “Qualification profile vs. operator profile”, page 16). a shorter solder pin length. Furthermore, concave components that collect the condensate should not be used. It may be necessary for potentially concave components to be fitted with run-off openings. Standardization of the reflow soldering process The current standards relating to the reflow soldering process should be broken down into standards that describe the process and standards for the qualification of components. 1. A standard that mainly describes the requirements for SMD components and the soldering process itself is DIN EN 61760-1 – Surface mounting technology – Standard method for the specification of surface mounting components (SMDs). 2. This series of standards has been extended to include THR components in Part 3. DIN EN 61760-3 – Surface mounting technology – Standard method for the specification of components for through-hole reflow (THR) soldering – describes the requirements for THR components and for the soldering process itself. 3. The process conditions described in DIN IEC 60068-2-58 – Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) – are used for qualification. The soldering profiles described in the application area of the standard can be used as the basis for the development of real soldering profiles. 4. A qualifying test for components can be found in standard IPC/JEDEC J-STD-020 – Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. This standard is used by Phoenix Contact for THR and SMD connectors and their testing. The test cycle is described in “Qualification of components for the reflow process” (see page 13). Basically, this standard only describes the qualification conditions for the housing plastic, it does not qualify the soldering. One thing to note about the qualification is the clear distinction between the maximum temperature loads for the manufacturer and those for the operator. A safety temperature buffer is specified here, which aims to avoid any overload by the operator. Recommended soldering profile Phoenix Contact qualifies reflow-solderable connectors and PCB terminal blocks in accordance with IPC/JEDEC J-STD 020. With information on the respective moisture sensitivity level and the classification temperature, the process operator is able to closely estimate the processability of the components in their line with their individual profiles. In practice, soldering profiles based on IPC/JEDEC J-STD 020 are more conservative, so that soldering 24 Phoenix Contact

Fig. 67: Assessment of the fill level for a 2.6 mm pin in a 1.6 mm thick PCB Fig. 68: Complete wetting of the soldering pad and 100% perimeter wetting Fig. 69: Typical lean THR soldering spot on the secondary side of the PCB with more than 75% soldering pad wetting and 100% perimeter wetting Soldering spots with pin ends protruding – standard pin The pin slightly protruding out of the secondary side of the PCB satisfies the minimum requirement for an assessable soldering spot in accordance with the standard. With the optimum configuration of all parameters, the requirements for all criteria are 100% satisfied. In the micro-section, a fill level of at least 75% is achieved. A small solder cone forms on both sides (Fig. 67 - 69). Quality of THR soldering spots THR soldering spots have a shape that is very similar to that of soldering spots created during wave or selective soldering. The main difference is the shape of the solder cone. Since less solder is available for the process, the solder cones that are formed are smaller or not fully developed. This special appearance must be discussed with the Quality Assurance department or taken into account when using automatic inspection systems (AOI). Soldering spots with countersunk pin Where space is needed on the secondary side of the PCB, it is expedient to use countersunk pins in the layout. A countersunk pin is a pin that does not protrude out of the hole on the secondary side of the PCB and whose soldering spot can therefore not be assessed based on the usual aforementioned criteria of IPC-A-610. This is permissible if the pin lengths are reduced by the manufacturer and the component sits directly flush on the primary side of the PCB. Certain strategies for quality assessment need to be developed in this case. Here, micro-sections show a reliable fill level and good formation of the solder cone below the component (Fig. 70 - 72). Fig. 70: Assessment of the fill level for a 1.4 mm pin in a 1.6 mm thick PCB Fig. 71: Assessment of the perimeter wetting and soldering pad wetting not defined in IPC Fig. 72: Soldering spot on the primary side of the PCB: perimeter wetting and soldering pad wetting in accordance with standard 26 Phoenix Contact

PCB connection technology for THR and SMT soldering processes Phoenix Contact offers a wide range of PCB terminal blocks, PCB connectors, and circular and data connectors for THR and SMT soldering. They enable you to automate your manufacturing process efficiently and combine high mechanical stability with high assembly density in a single production sequence. Push-in connection SPT-THR/SMD PCB terminal blocks with Push-in connection in SMD or THR design Single-level THR headers Plug-in direction vertical and horizontal to the PCB, versions with snap-in latch and threaded flange light connection High density High-position double- level, space-saving THR pin strips 28 Phoenix Contact Inverted THR contact systems Can be combined with inverted connectors and headers for touch-proof applications

Product overview PCB terminal blocks PCB terminal blocks enable the easy and safe transmission of signals, data, and power directly to the PCB. The space-saving connection method is suitable for numerous applications in the process industry and industrial environments. • For conductor cross-sections from 0.14 mm² to 6 mm² • For currents up to 41 A and voltages up to 320 V (IEC) • With screw, spring, or insulation displacement connection • For 2.5 mm to 5.08 mm pitch More information starting on page 30 PCB connectors Our PCB connectors offer a universal, maintenance-friendly conductor connection for almost all device designs from a wide range of industries and markets. • For conductor cross-sections from 0.14 mm² to 2.5 mm² • For currents up to 12 A and voltages up to 320 V (IEC) • With screw, spring, insulation displacement, or crimp connection More information starting on page 33 30 Phoenix Contact

PCB terminal blocks – 0.5 mm² to 1.5 mm² PCB terminal blocks, nominal cross-section up to 0.5 mm² Product family Notes No. of positions Pitch Current1) (A) Voltage1) 2) (V) Connection direction Screw connection with tension sleeve MPT-THR 0,5 THR soldering 2 - 12 2.54 6 IEC 6 UL (B) 160 IEC 150 UL (B) MPT-SMD 0,5 SMT soldering 2 - 12 2.54 6 IEC 6 UL (B) 160 IEC 150 UL (B) 0° 0°  Web code: #1231 Product family Notes No. of positions Pitch Current1) (A) Voltage1) 2) (V) Connection direction Push-in spring connection PTSM 0,5/..-H-THR Black, THR soldering 2 - 8 2.5 6 IEC 5 UL (B) 160 IEC 150 UL (B) PTSM 0,5/..-V-THR Black, THR soldering 2 - 8 2.5 6 IEC 5 UL (B) 160 IEC 150 UL (B) PTSM 0,5/..-H-SMD Black, SMT soldering 2 - 8 2.5 6 IEC 5 UL (B) 160 IEC 150 UL (B) PTSM 0,5/..-V-SMD Black, SMT soldering 2 - 8 2.5 6 IEC 5 UL (B) 160 IEC 150 UL (B) PTSM 0,5/..-H-THR PTSM 0,5/..-V-THR PTSM 0,5/..-H-SMD PTSM 0,5/..-V-SMD White, THR soldering Higher voltage possible (IEC in accordance with II/2: 320 V) White, THR soldering Higher voltage possible (IEC in accordance with II/2: 320 V) White, SMT soldering 1-pos. also available Higher voltage possible (IEC in accordance with II/2: 320 V) White, SMT soldering Higher voltage possible (IEC in accordance with II/2: 320 V) 2 - 8 2.5 6 IEC 5 UL (B) 160 IEC 150 UL (B) 2 - 8 2.5 6 IEC 5 UL (B) 160 IEC 150 UL (B) 1 - 8 2.5 6 IEC 5 UL (B) 160 IEC 150 UL (B) 2 - 8 2.5 6 IEC 5 UL (B) 160 IEC 150 UL (B) 0° 90° 0° 90° 0° 90° 0° 90°  Web code: #1232 Product family Notes No. of positions Pitch Current1) (A) Voltage1) 2) (V) Connection direction Insulation displacement connection (IDC) PTQ 0,3 – 2 2.5 4 IEC 2 UL (B) 160 IEC 150 UL (B) 0° 32 Phoenix Contact

PCB terminal blocks – 2.5 mm² to 6 mm² PCB terminal blocks, nominal cross-section up to 2.5 mm²  Web code: #2669 Product family Notes No. of positions Pitch Current1) (A) Voltage1) 2) (V) Connection direction Push-in spring connection SPT-THR 2,5/..-H THR soldering 2 - 12 5.0 SPT-THR 2,5/..-V THR soldering 2 - 12 5.0 24 IEC 20 UL (B) 10 (D) 400 IEC 300 UL (B) 300 (D) 24 IEC 20 UL (B) 10 (D) 400 IEC 300 UL (B) 300 (D) 0° 90° PCB terminal blocks, nominal cross-section up to 6 mm²  Web code: #0724 Product family Notes No. of positions Pitch Current1) (A) Voltage1) 2) (V) Connection direction Special spring connection design PTSPL 6 Without insulating housing With SUNCLIX spring connection 1 – 41 IEC 30 UL – 0° 1) Use Groups A - F in accordance with UL 2) IEC rated insulation voltage with overvoltage category III / pollution degree 2 34 Phoenix Contact

PCB connectors – 0.5 mm² to 1.5 mm² PCB connectors, nominal cross-section up to 0.5 mm²  Web code: #0743 Product family Notes No. of positions Pitch Current1) (A) Voltage1) 2) (V) Connection direction Headers: SMT soldering, male PTSM 0,5/..-HH-SMD Black 2 - 10 2.5 6 IEC 5 UL (B) 160 IEC 150 UL (B) PTSM 0,5/..-HH-SMD PTSM 0,5/..-HV-SMD PTSM 0,5/..-HTB-SMD White, higher voltage possible (IEC in accordance with II/2: 320 V) White, higher voltage possible (IEC in accordance with II/2: 320 V) White, higher voltage possible (IEC in accordance with II/2: 320 V) 2 - 8 2.5 6 IEC 5 UL (B) 160 IEC 150 UL (B) 2 - 8 2.5 6 IEC 5 UL (B) 160 IEC 150 UL (B) 2 - 8 2.5 6 IEC 5 UL (B) 160 IEC 150 UL (B) 0° 0° 90° -90°  Web code: #0744 Product family Notes No. of positions Pitch Current1) (A) Voltage1) 2) (V) Connection direction Inverted headers: SMT soldering, female PTSM 0,5/..-HHI-SMD Black 2 - 8 2.5 6 IEC 5 UL (B) 160 IEC 150 UL (B) PTSM 0,5/..-HHI-SMD White, higher voltage possible (IEC in accordance with II/2: 320 V) 2 - 8 2.5 6 IEC 5 UL (B) 160 IEC 150 UL (B) 0° 0°  Web code: #0747 Product family Notes No. of positions Pitch Current1) (A) Voltage1) 2) (V) Connection direction Insulation displacement connection (IDC) PST 1,0/..-H PST 1,0/..-V – – 2 - 16 3.5 8 IEC 10 UL (B) 250 IEC 300 UL (B) 2 - 16 3.5 8 IEC 10 UL (B) 250 IEC 300 UL (B) 0° 90°  Web code: #0748 Product family Notes No. of positions Pitch Current1) (A) Voltage1) 2) (V) Connection direction Insulation displacement connection (IDC) FK-MPT 0,5/..-ICA FK-MPT 0,5/..-ICVA Header for FK-MPT 0,5/..-V PCB terminal blocks Header for FK-MPT 0,5/..-V PCB terminal blocks 2 - 16 3.5 3 IEC 250 IEC 4 UL (B, D) 300 UL (B, D) 2 - 16 3.5 3 IEC 250 IEC 4 UL (B, D) 300 UL (B, D) 0° 90° 36 Phoenix Contact

PCB connectors – 2.5 mm² to 10 mm² PCB connectors, nominal cross-section up to 2.5 mm²  Web code: #0752 Product family Notes No. of positions Pitch Current1) (A) Voltage1) 2) (V) Connection direction Pin strips: THR soldering PST 1,3/..-H THR-/wave-solderable 2 - 16 5.0 PST 1,3/..-V THR-/wave-solderable 2 - 16 5.0 12 IEC 16 UL (B) 10 UL (D) 320 IEC 300 UL (B) 300 UL (D) 12 IEC 16 UL (B) 10 UL (D) 320 IEC 300 UL (B) 300 UL (D) 0° 90°  Web code: #0789 Product family Notes No. of positions Pitch Current1) (A) Voltage1) 2) (V) Connection direction Headers: THR soldering, male CCA 2,5/..-G CC 2,5/..-GF CCA 2,5/..-G-RN CC 2,5/..-GF-LR Without flange With threaded flange With snap-in latch With lock-and-release locking system 2 - 24 2 - 12 2 - 12 2 - 24 5.0/5.08 5.08 5.08 5.0/5.08 12 IEC 10 UL (B) 10 UL (D) 320 IEC 300 UL (B) 300 UL (D) CCVA 2,5/..-G CCV 2,5/..-GF CCVA 2,5/..-G-RN CCV 2,5/..-GF-LR Without flange With threaded flange With snap-in latch With lock-and-release locking system 2 - 24 2 - 12 2 - 12 2 - 24 5.0/5.08 5.08 5.08 5.0/5.08 12 IEC 10 UL (B) 10 UL (D) 320 IEC 300 UL (B) 300 UL (D) CCDN 2,5/..-G1-THR CCDN 2,5/..-G1F-THR Without flange With threaded flange 2 - 18 5.0/5.08 12 IEC 10 UL (B) 10 UL (D) 400 IEC 300 UL (B) 300 UL (D) MSTBO 2,5/..-G1R-THR MSTBO 2,5/..-G1L-THR Right version Left version 2 - 4 5.0 16 IEC 400 IEC 300 UL (B) 300 UL (D) 0° 90° 0° 0° PCB connectors, nominal cross-section up to 4 mm² Product family Notes No. of positions Pitch Current1) (A) Voltage1) 2) (V) Connection direction Headers: THR soldering, male PC 4/..-G-6,35 Without flange, with top lock and center flange 2 - 12 6.35 24 IEC 3) 22 UL (B)4) 22 UL (C)4) 22 UL (F)4) 1000 IEC 3) 600 UL (B)4) 600 UL (C)4) 600 UL (F)4) 0° 1) Use Groups A - F in accordance with UL 2) IEC rated insulation voltage with overvoltage category III / pollution degree 2 3) This technical data is expected, final tests not yet performed 4) The specified value is expected upon approval 38 Phoenix Contact

Circular connectors, signal M12, solder connection, PCB mounting 4-pos. For reflow soldering processes Coding Rated voltage Nominal current  Web code: #1167 Pin assignment Two-piece, THR contact carriers A 250 V 4 A D 250 V 4 A Male Female Male Female 4 1 3 2 3 2 4 1 4 1 3 2 3 2 4 1 Straight, shielded, THR, in tray 1439939 1552214 1551451 Straight, shielded, THR, on reel 1457500* 1457623* 1457513* 1457636* Straight, THR, in tray Straight, THR, on reel 1437164 1439942 1457490* 1457610* – – 1414071 – Two-piece, housing screw connections for THR soldering contact carriers Screw versions with O-ring, rear mounting, M15 x 1 screw fastening SPEEDCON screw versions with O-ring, rear mounting, M15 x 1 screw fastening Clip-in versions, for straight, two-piece socket contact carriers, tolerance-compensating, rear snap-in mounting (not for S-coded THR contact carriers) For housing panel thickness of 1.0 ... 1.8 mm For housing panel thickness of 1.7 ... 2.5 mm For housing panel thickness of 2.4 ... 3.2 mm Threaded sleeve For housing panel thickness of 3.1 ... 3.9 mm Fixing sleeve, can be used universally with any threaded sleeve Color SPEEDCON screw versions with O-ring, front mounting, M12 x 1 screw fastening Screw versions with O-ring, front mounting, M12 x 1 screw fastening SPEEDCON screw versions with flat gasket, front mounting, M12 x 1 screw fastening Press-in versions, front mounting 40 Phoenix Contact

Circular connectors, signal M12, solder connection, PCB mounting 4-pos. For reflow soldering processes Coding Rated voltage Nominal current  Web code: #0215 Pin assignment Two-piece, SMD contact carriers A 250 V 4 A D 250 V 4 A Male Female Male Female 4 1 3 2 3 2 4 1 4 1 3 2 3 2 4 1 Straight, SMD, in tray 1411924* 1411907 1411925* 1411912 Straight, SMD, on reel 1411982* 1411974 1411983* 1411975 Straight, shielded, SMD, in tray, additional gasket for the device when not plugged in Straight, shielded, SMD, on reel, additional gasket for the device when not plugged in Straight, SMD, in tray, additional gasket for the device when not plugged in Straight, SMD, on reel, additional gasket for the device when not plugged in 1411955* 1411949 1411956* 1411950 1412010* 1412004 1412011* 1412005 1411941* 1411935 1411942* 1411936 1411996* 1411990 1411997* 1411991 Two-piece, housing screw connections for SMD contact carriers Screw versions, rear mounting, M15 x 1 screw fastening SPEEDCON screw versions, rear mounting, M15 x 1 screw fastening Clip-in versions, tolerance-compensating, rear snap-in mounting, threaded sleeve For housing panel thickness of 0.9 ... 1.6 mm For housing panel thickness of 1.6 ... 2.3 mm For housing panel thickness of 2.3 ... 3.0 mm Fixing sleeve, can be used universally with any threaded sleeve Color Screw versions, front mounting, M14 x 1 screw fastening M14 x 1 flat nut Press-in versions, front mounting 42 Phoenix Contact

Circular connectors, signal Signal – M8, solder connection, PCB mounting For reflow soldering processes Coding Rated voltage Nominal current  Web code: #0219 Pin assignment Two-piece, SMD contact carriers 3-pos. A 50 V AC / 60 V DC 4 A Male Female 4 4 1 3 3 1 Straight, SMD, in tray 1412225* 1412220 Straight, SMD, on reel 1412248* 1412243 Straight, shielded, SMD, in tray, additional gasket for the device when not plugged in Straight, shielded, SMD, on reel, additional gasket for the device when not plugged in Straight, SMD, in tray, additional gasket for the device when not plugged in Straight, SMD, on reel, additional gasket for the device when not plugged in 1412240* 1412235 1412263* 1412257 1412233* 1412227 1412255* 1412250 Two-piece, housing screw connections for SMD contact carriers Screw versions, rear mounting, M12 x 1 screw fastening Screw versions, front mounting, M10 x 0.75 screw fastening M10 x 0.75 flat nut Press-in versions for front mounting 44 Phoenix Contact

Circular connectors, data M12 for networks For reflow soldering processes Coding Rated voltage Nominal current Conductor cross-section  Web code: #0240 Pin assignment Two-piece, contact carriers for wave and reflow soldering processes Straight, shielded, THR, in blister packaging Straight, shielded, THR, on reel Straight, shielded, SMD, in tray Straight, shielded, THR, on reel Straight, shielded, THR, in blister packaging Straight, shielded, THR, on reel Straight, shielded, SMD, in tray Hybrid Housing screw connections for SMD contact carriers, see page 42/43. M8 for fieldbuses Coding Rated voltage Nominal current Conductor cross-section  Web code: #0237 Pin assignment Two-piece, SMD contact carriers for reflow soldering processes Straight, SMD in tray Straight, SMD on reel Straight, SMD in tray, additional gasket for the device when not plugged in Straight, SMD on reel, additional gasket for the device when not plugged in Shielded Shielded Housing screw connections for SMD contact carriers, see page 42/43. * Contact carrier with assembly pad 1) Distance from PCB upper edge to housing front panel rear edge: 6 mm 2) Distance from PCB upper edge to housing front panel outer edge: 9 mm 46 Phoenix Contact 8-pos. X (CAT6A) 8-pos. Y (hybrid) 50 V AC / 60 V DC 30 V 0.5 A 0.25 mm² Female 3 2 4 1 5 8 6 7 1402457 1413446* 1411964* 1424180 – – – 0.5 A / 6 A 0.14/0.5 mm² Female 2 3 1 7 8 6 4 5 – – – – 1405225 1413445* 1411965* 5-pos. B 30 V AC / 30 V DC 3 A 0.25 mm² Female 4 2 3 1 5 1412222 1412245 1412229 1412237 1412252 1412259

USB 2.0 USB 3.2 Gen. 1 USB 2.0 USB 3.2 Gen. 2 USB type A USB type A 90° horizontal SMD 1332634 180° vertical THR 1430989 USB type C 180° vertical 90° horizontal SMD 1332645 1332646 90° horizontal SMD/THR 1332643 HDMI 2.0 HDMI type A SMD 180° 1332073 Wave / THR R-SMA 90° 1340150 90° 1332071 Wave / THR SMA 90° 1340151 Data connectors USB device connectors Web code: #2888 Version Type Orientation Soldering process Item no. HDMI device connectors Web code: #2889 Version Type Orientation Soldering process Item no. Coaxial PCB connectors Web code: #2890 Soldering process Series Version Item no. 48 Phoenix Contact

Concave components Components which, due to the geometry of their housing, tend to accumulate condensates in the vapor phase soldering oven. Without suitable run-off options, these components remove the condensate from the soldering process. A high condensate loss level makes the process expensive. Contact pads Any type and form of metallic contact surface for the application of solder on the top side of the PCB (in contrast to the conductive path). Convection soldering Reflow soldering through heat transfer via hot gases (air or nitrogen). Coplanarity Coplanarity refers to the maximum distance of all connection contacts (including armatures) of an SMD component from the contact surface (in this case the PCB surface). It is a measure of whether all contacts have contact with the paste and are therefore able to form soldering spots at a defined paste thickness. Countersunk pin A pin with a pin length that is less than the thickness of the PCB. The resulting soldering spot does not form a visible solder cone on the secondary side. Creepage distances Insulation coordination Minimum distance across the insulating medium between two live metal parts that must be maintained in order to prevent voltage flashover. Dry bag Outer packaging that significantly reduces the access of air to the contents and keeps the contents dry for a defined period of time. Feeder Feeder unit for tapes on pick-and-place machines. Floor life Applies to dried, moisture-sensitive components. Upon opening the dry outer packaging (dry bag) the exposure time (floor life) begins, which depending on the MSL is a measure for problem-free processing in the reflow oven. Once the floor life has expired, there is an increased risk of damage to the component. In order that it can be used again, the component must be re-dried. Gullwing Refers to a certain type of contact geometry on components. In particular the arched, angled component connections on ICs (integrated circuits) or also pin strips are named after the style of the winged doors on the legendary Mercedes-Benz 300 SL. Inline system Layout of a production line in a physically connected line; all units (printer, assembly machine, reflow oven, AOI, and accessory components) are arranged one after the other in the process sequence. Advantage: transparent, reproducible process. Disadvantage: the slowest device determines the process speed. IPC Association Connecting Electronics Industries – standardization organization based in Illinois, USA, involved in electronics production. JEDEC Solid State Technology Association – US organization involved in the standardization of semiconductors. Level goods Common designation for all components that have an MSL higher than 1 in accordance with IPC-J-STD-020 and must therefore be handled in a special way due to their moisture absorption capability. Mounting bosses Additional design elements (part of the component housing), usually in the form of pins, which are positioned in holes on the PCB to prevent the component twisting due to floating during the soldering process. Glossary Antistatic PE bag Electrostatically conductive polyethylene bag used as packaging for THR/SMD components. AOI Automated optical inspection Devices with camera systems that are able to inspect soldering spots. A comparison is made between the captured image of the soldering spot and reference images. Armature Additional design element made of metal with a relatively large contact surface, usually mounted on the side of components. When soldered, it provides additional fixing for the SMD component and lessens the load on the current carrying contacts. Blister Synonym for tape, in this case more in connection with drawings for production documentation – blister drawing. Capillary effect In general, the behavior of fluid in contact with tubes or hollow shaped geometries. Here, the effect of the solder filling in and through the hole in which the pin is positioned from the bottom to the top side of the PCB. Caution label Warning information on a label on outer packaging (mostly dry bags) regarding the handling of potentially moisture-sensitive materials. Classification temperature Working temperature for the component determined through testing in accordance with JEDEC J-STD-020. The manufacturer must test approximately 5°C above this temperature, the operator solders approximately 5°C below this temperature. This prevents any misunderstandings regarding the maximum load of the component. Clearances Insulation coordination Minimum distance through air between two live metal parts that must be maintained in order to prevent voltage flashover. 50 Phoenix Contact

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